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ID 468, 3.15x3.13mm, 49 Ball, 7x7 Layout, 0.4mm Pitch, https://www.st.com/resource/en/datasheet/stm32g031y8.pdf ST WLCSP-20, ST die ID 450, 4.96x4.64mm, 156 Ball, 13x12 Layout, 0.35mm Pitch, https://www.ti.com/lit/ml/mxbg383/mxbg383.pdf, https://www.ti.com/lit/ds/symlink/tps62800.pdf Texas Instruments, DSBGA-6, 0.704x1.054mm, NSMD, YKA pad definition, 0.95x1.488mm, 6 Ball, 2x3 Layout, 0.4mm Pitch, https://www.st.com/resource/en/datasheet/stm32wb55vc.pdf Texas Instruments HSOP 9, 1.27mm pitch, double cols (from Kicad 4.0.7), script generated Through hole straight socket strip, 1x33, 1.00mm pitch, 2.0mm pin length, double rows Through hole angled pin header, 2x19, 2.00mm pitch, 4.2mm pin length, double rows Through hole straight pin header, 2x39, 2.54mm pitch, double rows Through hole angled pin header, 1x28, 1.27mm pitch, double rows Through hole horizontal IDC header THT 2x03 1.27mm double row Through hole straight pin header, 2x11, 2.00mm.

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