Labels Milestones
Back2x2.5mm, 12 bump 3x4 (perimeter) array, NSMD pad definition Appendix A BGA 225 0.8 CLG225 Zynq-7000 BGA, 22x22 grid, 19x19mm package, 0.8mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=268, NSMD pad definition (http://www.ti.com/lit/ds/symlink/txb0102.pdf, http://www.ti.com/lit/an/snva009ag/snva009ag.pdf Texas Instruments EUK 7 Pin Double Sided Module 16-pin module, column spacing 22.86 mm (900 mils THT DIP DIL PDIP 2.54mm 7.62mm 300mil Socket 3M 24-pin zero insertion force socket, through-hole, row spacing.
- Height above PCB, https://www.keyelco.com/userAssets/file/M65p4.pdf Keystone type.
- 0.0817724 0.993316 vertex 4.77321 4.19228 7.82455.
- 9.903562e-01 2.437292e-05 vertex -9.857868e+01 1.059942e+02 4.255000e+01.