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LED, https://docs.broadcom.com/docs/ASMB-KTF0-0A306-DS100 LED Avago PLCC-4 3528 CLV1A-FKB LED Cree PLCC-4 2020 CLMVB-FKA CLMVC-FKA 3.2mm x 2.8mm PLCC4 RGB LED, clear, SMD, https://www.lumex.com/spec/SML-LX0303SIUPGUSB.pdf Lumex RGB LED, https://assets.cree-led.com/a/ds/h/HB-CLV1A-FKB.pdf LED Cree PLCC-4 3528 LED RGB NeoPixel Nano PLCC-4 2020 CLMVB-FKA CLMVC-FKA 3.2mm x 2.8mm PLCC4 LED, https://assets.cree-led.com/a/ds/h/HB-CLMVC-FKA.pdf LED Cree PLCC-4 5050 5.0mm x 5.0mm PLCC4 LED 4.7mm x 1.5mm PLCC6 LED, http://www.cree.com/led-components/media/documents/1381-QLS6AFKW.pdf Cree XHP50, 6V footprint, http://www.cree.com/~/media/Files/Cree/LED%20Components%20and%20Modules/XLamp/Data%20and%20Binning/ds%20XHP50.pdf Cree XHP70 LED, 6V version, http://www.cree.com/~/media/Files/Cree/LED%20Components%20and%20Modules/XLamp/Data%20and%20Binning/ds%20XHP70.pdf Cree XHP70 LED, 12V version, http://www.cree.com/~/media/Files/Cree/LED%20Components%20and%20Modules/XLamp/Data%20and%20Binning/ds%20XHP70.pdf LED Cree-XQ handsoldering pads http://www.cree.com/~/media/Files/Cree/LED-Components-and-Modules/XLamp/Data-and-Binning/ds-XQB.pdf LED SMD 2010 (5025 Metric), square (rectangular) end terminal, IPC_7351 nominal, (Body size source: http://www.tortai-tech.com/upload/download/2011102023233369053.pdf), generated with kicad-footprint-generator Inductor SMD 2010 (5025 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size from: http://datasheets.avx.com/AVX-HV_MLCC.pdf), generated with kicad-footprint-generator ipc_noLead_generator.py LFCSP, 28 Pin (https://pdfserv.maximintegrated.com/package_dwgs/21-0140.PDF (T2055-3)), generated with kicad-footprint-generator Molex Sabre Power Connector, 46007-1106, 6 Pins per row (http://www.te.com/commerce/DocumentDelivery/DDEController?Action=srchrtrv&DocNm=82181_SOFTSHELL_HIGH_DENSITY&DocType=CS&DocLang=EN), generated with kicad-footprint-generator ipc_noLead_generator.py 10-Lead Plastic Dual Flat, No Lead Package (ML) - 8x8x0.9 mm Body [TQFP] With Exposed Pad [eTSSOP] (see Microchip Packaging Specification 00000049BS.pdf VQFN, 16 Pin package with 1.27mm pin pitch, compatible with SOIC-8, 3.9x4.9mm body, exposed pad, DDA0008J (http://www.ti.com/lit/ds/symlink/tps5430.pdf Texas Instruments DSBGA BGA YZP R-XBGA-N8 Texas Instruments, DSBGA, 1.5195x1.5195x0.600mm, 8 ball 3x3.

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