3
1
Back

CTS_Series194-11MSTN, Piano, row spacing 10.16 mm (400 mils), SMDSocket, LongPads 40-lead though-hole mounted DIP package, row spacing 15.24 mm (600 mils 64-lead though-hole mounted DIP package, row spacing 11.48 mm (451 mils 12-lead though-hole mounted DIP package, row spacing 10.16 mm (400 mils), LongPads 64-lead though-hole mounted DIP package, row spacing 5.08 mm (200 mils), body size 10.8x26.96mm 10x-dip-switch SPST , Slide, row spacing 7.62 mm (300 mils), body size 6.7x9.18mm (see e.g. Https://www.ctscorp.com/wp-content/uploads/206-208.pdf 10x-dip-switch SPST , Slide, row spacing 7.62 mm (300 mils), see http://cdn-reichelt.de/documents/datenblatt/A400/HDBL101G_20SERIES-TSC.pdf DIL DIP PDIP 2.54mm 7.62mm 300mil Vishay HVMDIP HEXDIP DirectFET L4 MOSFET Infineon DirectFET MT MOSFET Infineon DirectFET ME MOSFET Infineon DirectFET L8 MOSFET Infineon DirectFET SA MOSFET Infineon DirectFET MC MOSFET Infineon DirectFET SC MOSFET Infineon DirectFET ST.

New Pull Request