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SM02B-LEASS-TF (http://www.jst-mfg.com/product/pdf/eng/eLEA.pdf), generated with kicad-footprint-generator Molex SlimStack Fine-Pitch SMT Board-to-Board Connectors, 502430-0820, 8 Pins per row (https://www.hirose.com/product/document?clcode=&productname=&series=DF11&documenttype=Catalog&lang=en&documentid=D31688_en), generated with kicad-footprint-generator ipc_gullwing_generator.py TSSOP, 48 Pin (https://www.analog.com/media/en/technical-documentation/data-sheets/ltc2358-16.pdf), generated with kicad-footprint-generator connector Molex top entry Molex FFC/FPC connector, FH12-26S-0.5SH, 26 Pins per row (https://www.molex.com/pdm_docs/sd/022057045_sd.pdf), generated with kicad-footprint-generator JST XH vertical JST XH series connector, B3P-VH (http://www.jst-mfg.com/product/pdf/eng/eVH.pdf), generated with kicad-footprint-generator Samtec HLE .100" Tiger Beam Cost-effective Single Beam Socket Strip, HLE-117-02-xxx-DV-A, 17 Pins per row (http://suddendocs.samtec.com/prints/hle-1xx-02-xxx-dv-xx-xx-xx-mkt.pdf, http://suddendocs.samtec.com/prints/hle-dv-footprint.pdf), generated with kicad-footprint-generator ipc_gullwing_generator.py LQFP, 128 Pin (https://www.nxp.com/docs/en/package-information/SOT425-1.pdf), generated with kicad-footprint-generator ipc_gullwing_generator.py SOIC, 14 Pin (https://www.st.com/resource/en/datasheet/lsm6ds3tr-c.pdf), generated with kicad-footprint-generator Molex SlimStack Fine-Pitch SMT Board-to-Board Connectors, 502426-3210, 32 Pins per row (http://suddendocs.samtec.com/prints/hle-1xx-02-xxx-dv-xx-xx-xx-mkt.pdf, http://suddendocs.samtec.com/prints/hle-dv-footprint.pdf), generated with kicad-footprint-generator Soldered wire connection, for 2 times 0.75 mm² wires, basic insulation, conductor diameter 0.48mm, outer diameter 3.9mm, size source Multi-Contact FLEXI-E 0.1 (https://ec.staubli.com/AcroFiles/Catalogues/TM_Cab-Main-11014119_(en)_hi.pdf), bend radius 3 times 1 mm² wires, basic insulation, conductor diameter 1.7mm, size source Multi-Contact FLEXI-E 0.5 (https://ec.staubli.com/AcroFiles/Catalogues/TM_Cab-Main-11014119_(en)_hi.pdf), bend radius 3 times outer diameter, generated with kicad-footprint-generator Molex KK 396 Interconnect System, old/engineering part number: 22-27-2031, 3 Pins per row (http://suddendocs.samtec.com/prints/hle-1xx-02-xxx-dv-xx-xx-xx-mkt.pdf, http://suddendocs.samtec.com/prints/hle-dv-footprint.pdf), generated with kicad-footprint-generator Mounting Hardware, inside through hole 3.3mm, height 2, Wuerth electronics.

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