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TR-x2DA(T) modules, http://iqrf.org/weben/downloads.php?id=104 8 pin SIM connector for PCB's with 05 contacts (not polarized Highspeed card edge connector for 2.4mm PCB's with 20 contacts (polarized Highspeed card edge connector for 2.4mm PCB's with 60 contacts (not polarized Highspeed card edge connector for 2.4mm PCB's with 08 contacts (polarized Highspeed card edge connector for 2.4mm PCB's with 20 contacts (polarized Highspeed card edge connector for 2.4mm PCB's with 60 contacts (not polarized Highspeed card edge card connector socket for 1.57mm PCBs, vertical (source: https://suddendocs.samtec.com/prints/hsec8-1xxx-xx-xx-dv-x-xx-footprint.pdf conn samtec discrete wire terminal Samtec Micro Mate Discrete Wire Terminal Strip, 1.00 mm Pitch, Single Row, Vertical, Latch (source: https://suddendocs.samtec.com/prints/t1m-single-row-footprint.pdf Samtec Micro Mate Discrete Wire Terminal Strip, 1.00 mm Pitch, Single Row, Vertical, Latch (source: https://suddendocs.samtec.com/prints/t1m-single-row-footprint.pdf conn samtec card-edge high-speed Highspeed card edge card connector socket for 1.57mm PCBs, vertical, alignment pins (source: https://suddendocs.samtec.com/prints/hsec8-1xxx-xx-xx-dv-x-xx-footprint.pdf conn samtec card-edge socket high-speed 0.8 mm Highspeed card edge connector for 2.4mm PCB's with 20 contacts (polarized Highspeed card edge card connector socket for 2.36mm PCBs, vertical, alignment pins (source: https://suddendocs.samtec.com/prints/hsec8-1xxx-xx-xx-dv-x-xx-footprint.pdf 0.8 mm BGA-64, 10x10 raster, 4.201x4.663mm package, pitch 0.8mm; see section 7.6 of http://www.st.com/resource/en/datasheet/stm32l151cc.pdf WLCSP-64, 8x8 raster, 3.623x3.651mm package, pitch 0.4mm; see section 6.1 of http://www.st.com/resource/en/datasheet/stm32f405og.pdf WLCSP-100, 10x10 raster, 10x10mm package, pitch 0.4mm; see section 7.1 of http://www.st.com/resource/en/datasheet/stm32f410t8.pdf WLCSP-49, 7x7 raster, 3.294x3.258mm package, pitch 0.4mm; see section 7.6 of http://www.st.com/resource/en/datasheet/stm32f207vg.pdf WLCSP-66, 8x9 raster, 3.767x4.229mm package, pitch 0.5mm; see section 7.6 of http://www.st.com/resource/en/datasheet/stm32f207vg.pdf VFBGA-49, 7x7, 5x5mm package, pitch 0.6mm; http://ww1.microchip.com/downloads/en/DeviceDoc/39969b.pdf Zynq-7000 BGA, 30x30 grid, 31x31mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=297, NSMD pad definition Appendix A BGA 676 1 FG676 FGG676 Spartan-7 BGA, 26x26 grid.

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