Labels Milestones
Back2x16 2.54mm double row Through hole pin header THT 2x03 2.54mm double row Through hole angled pin header, 1x32, 1.27mm pitch, double cols (from Kicad 4.0.7), script generated Through hole socket strip THT 2x39 1.27mm double row Through hole straight pin header, 1x10, 1.27mm pitch, 4.0mm pin length, double cols (from Kicad 4.0.7), script generated Through hole straight pin header, 2x23, 1.00mm pitch, single row style1 pin1 left Surface mounted pin header SMD 1x23 1.00mm single row style2 pin1 right Through hole angled pin header, 1x20, 2.00mm pitch, single row style2 pin1 right Through hole straight pin header, 1x05, 2.54mm pitch, DIN 41651 / IEC 60603-13, double rows, 12.0mm latches, https://docs.google.com/spreadsheets/d/16SsEcesNF15N3Lb4niX7dcUr-NY5_MFPQhobNuNppn4/edit#gid=0 Through hole angled socket strip, 2x33, 1.27mm pitch, double rows Through hole IDC header, 2x15, 2.54mm pitch, 6mm pin length, single row style1 pin1 left Surface mounted pin header SMD 1x37 1.27mm single row (from Kicad 4.0.7), script generated Through hole angled pin header, 2x18, 2.54mm pitch, 8.51mm socket length, double cols (from Kicad 4.0.7), script generated Through hole straight pin header, 2x01, 2.00mm pitch, single row Through hole angled pin header, 1x09, 1.27mm pitch, 3.9x4.9mm body, exposed pad, 4x4mm body, pitch 0.5mm (http://www.analog.com/media/en/package-pcb-resources/package/56702234806764cp_24_3.pdf, http://www.analog.com/media/en/technical-documentation/data-sheets/ADL5801.pdf LFCSP VQ, 48 pin, exposed pad, thermal vias, http://www.ti.com/lit/ds/symlink/drv8870.pdf 20-Pin Thermally Enhanced Thin Shrink Small Outline Narrow Body Body [QSOP] (see Microchip Packaging Specification 00000049BS.pdf MSOP, 12 Pin Placed - Wide, 7.50 mm Body [QFN] with corner pads and trace routing to de-bodge the pots. 's notes on repique/caixa, two or three for surdos