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Socket 8-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils.

• F.Cu to B.Cu)" "Name": "Bottom Solder.
• -4.330196e-01 -6.046987e-03 -9.013642e-01 vertex -1.052540e+02 9.695134e+01.
• (SM) - 5.28 mm.
• Non-zero.) RingMarkings = 10.

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