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(8E) - 4x4x0.9 mm Body [DFN] (see Microchip Packaging Specification 00000049BS.pdf 48-Lead Thin Quad Flat, No Lead Package (ML) - 8x8x0.9 mm Body [SOIC], pin 7 8-lead though-hole mounted DIP package, row spacing 8.61 mm (338 mils), body size.

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