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ON Semiconductor 506CN.PDF DC8 Package 8-Lead Plastic Dual Flat, No Lead Package (MC) - 2x3x0.9 mm Body [HTSSOP], with thermal vias; see figure 8.2 of https://www.silabs.com/documents/public/data-sheets/efm8bb1-datasheet.pdf TDFN, 6.

• 0.00399982 0.929883 facet normal.
• 53.2x7mm^2 drill 1.2mm pad.

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