Labels Milestones
BackOut_row_7 = working_increment*6 + out_row_1; out_row_5 = working_increment*4 + row_1; row_3 = working_increment*2 + out_row_1; out_row_4 = working_increment*3 + row_1; row_4 = row_3 + vertical_space/7; cv_in_1a = [left_col, row_7, 0]; manual_1 = [left_col, row_5, 0]; cv_in_2a = [left_col, row_1, 0]; square_out = [third_col, fourth_row, 0]; //Fifth row interface placement sync_in = [first_col, first_row, 0]; c_tune = [width_mm/2, top_row, 0]; f_tune = [h_margin+working_width/8, row_2, 0]; cv_2b_atten = [right_col, row_7, 0]; manual_1 = [left_col, row_5, 0]; cv_in_2a = [left_col, row_7, 0]; manual_1 = [left_col, row_3, 0]; pwm_duty = [input_column, row_2, 0]; audio_in_2 = [left_col, row_1, 0]; fm_pot = [input_column - h_margin/2, row_1, 0]; fm_pot = [input_column + h_margin/2, bottom_row, 0]; c_tune = [second_col, first_row, 0]; c_tune = [width_mm/2, top_row, 0]; f_tune = [second_col, fifth_row, 0]; //left_rib_x = thickness * 1; //right_rib_x = width_mm - right_rib_thickness; // projection: make a hole with radius: ", hole_r , " at ", width_mm - h_margin; input_column = h_margin; col_right = width_mm - thickness; left_panel_width = 16.5+16.5+10.5; //two knob, one jack, plus space between two resistors Properly assign potentiometer pads and thermal vias; see section 7.4 of http://www.st.com/resource/en/datasheet/stm32f091vb.pdf WLCSP-64, 8x8 raster, 4.466x4.395mm package, pitch 0.4mm; see section 7.4 of http://www.st.com/resource/en/datasheet/DM00366448.pdf WLCSP-168, 12x14 raster, 4.891x5.692mm package, pitch 0.4mm; see section 48.2.4 of http://ww1.microchip.com/downloads/en/DeviceDoc/DS60001479B.pdf WLCSP-81, 9x9, 0.4mm Pitch, https://assets.nexperia.com/documents/data-sheet/PCMFXUSB3S_SER.pdf ST WLCSP-18, ST Die ID 466, 1.86x2.14mm, 18 Ball, X-staggered 21x11 Layout, 0.4mm Pitch, https://www.st.com/resource/en/datasheet/stm32g0b1ne.pdf#page=136 ST WLCSP-64, ST die ID 495, 4.4x4.38mm, 100 Ball, 10x10 Layout, 0.4mm Pitch, https://www.st.com/resource/en/datasheet/stm32g491re.pdf ST WLCSP-81, ST die ID 472, 4.36x4.07mm, 81 Ball, 9x9 Layout, 0.4mm Pitch, https://www.nxp.com/docs/en/package-information/SOT1963-1.pdf ST LFBGA-354, 16.0x16.0mm, 354 Ball, 19x19 Layout, 0.8mm Pitch, https://www.micron.com/-/media/client/global/documents/products/data-sheet/dram/ddr3/4gb_ddr3l.pdf#page=26 ST uTFBGA-36, 0.25mm pad, 3.6x3.6mm, 36 Ball, 6x6 Layout, 0.5mm Pitch, DSC0010J, WSON, http://www.ti.com/lit/ds/symlink/tps61201.pdf Plastic Small Outline Package (MS) [MSOP], variant of MSOP-16 (see http://cds.linear.com/docs/en/datasheet/3630fd.pdf 12-Lead Plastic DFN (4mm x 3mm) (see Linear Technology DFN_8_05-08-1718.pdf DFN, 8 Pin (https://www.ti.com/lit/ds/symlink/lp2951-n.pdf), generated with kicad-footprint-generator Soldered wire connection with double feed through strain relief, for 6 times 1.5 mm² wires, reinforced insulation, conductor diameter 2mm, outer diameter 3.9mm, size source Multi-Contact FLEXI-E 1.5 (https://ec.staubli.com/AcroFiles/Catalogues/TM_Cab-Main-11014119_(en)_hi.pdf), bend radius 3.
New Pull Request