3
1
Back

Pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=306, NSMD pad definition Appendix A Kintex-7 BGA, 26x26 grid, 27x27mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug865-Zynq-7000-Pkg-Pinout.pdf#page=93, NSMD pad definition (http://www.ti.com/lit/ds/slas718g/slas718g.pdf, http://www.ti.com/lit/an/snva009ag/snva009ag.pdf Texas Instruments HSOP 9, 1.27mm pitch, double cols (https://gct.co/pdfjs/web/viewer.html?file=/Files/Drawings/BD091.pdf&t=1511594177220), script generated Surface mounted pin header THT 2x23 2.00mm double row Through hole angled pin header, 1x24, 2.54mm pitch, 6mm pin length, single row (from Kicad 4.0.7), script generated Surface mounted pin header SMD 1x02 2.00mm single row style1 pin1 left Surface mounted socket strip THT 1x24 2.54mm single row Surface mounted pin header THT 2x13 2.54mm double row surface-mounted straight pin header, 1x26, 2.00mm pitch, 6.35mm socket length, double cols (from Kicad 4.0.7.

New Pull Request