Labels Milestones
BackYZP Texas Instruments, DSBGA, 1.4715x1.4715mm, 9 bump 3x3 (perimeter) array, NSMD pad definition Appendix A BGA 238 0.5 CP236 CPG236 Artix-7 BGA, 19x19 grid, 10x10mm package, pitch 0.4mm; see section 7.5 of http://www.st.com/resource/en/datasheet/stm32f051t8.pdf.
- -5.30329 5.30329 6.0001 vertex.
- 0.083183 -0.0810354 0.993234 vertex 4.3279 -5.83299 7.92316 facet.
- Https://www.ti.com/lit/ml/mxbg078z/mxbg078z.pdf BGA 6 0.4 YFF0006.
- "microvia_diameter": 0.3, "microvia_drill": 0.1.