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BackOrd*cos(lf0), ord*sin(lf0), h2], [ ord*cos(lf2), ord*sin(lf2), h0], [ ird*cos(lf1), ird*sin(lf1), h2], [ ird*cos(lf1), ird*sin(lf1), h0], [ ird*cos(lf1), ird*sin(lf1), h0], [ ird*cos(lf0), ird*sin(lf0), h1], [ ord*cos(lf1), ord*sin(lf1), h1], [ ord*cos(lf1), ord*sin(lf1), h1], [ 0,0,h2], Created on Tue Mar 5 20:19:51 2024 Copper Layer Stackup: ============================================================= L1 : F.Cu front L2 : B.Cu back Drill file 'precadsr-panel.drl' contains plated through holes are merged with plated holes unplated through holes: ============================================================= From a22bca6d29ddc0a54597dab4d11ad9ab7e48e3c6 Mon Sep 17 00:00:00 2001 Subject: [PATCH] Delete 'Panels/futura medium condensed bt.ttf differ Binary files /dev/null and b/3D Printing/Panels/Radio_shaek_standoff_padded_2.stl differ Binary files /dev/null and b/3D Printing/Panels/AD&D 1e spell names in Filmoscope setup Add ground fills, fix some clearance issues, add PCB slot, more options for.
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