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Lines main VCA/Schematics/Dual_VCA.diy 8460 lines // CV out - CLK out - RESET / CASCADE out - could be done with a 7-segment display with LED backlight http://www.lcd-module.com/fileadmin/eng/pdf/grafik/ediptft43-ae.pdf TFT-graphic display 320x240 16 bit colour with led backlight http://www.lcd-module.com/fileadmin/eng/pdf/grafik/ediptft32-ae.pdf TFT-graphic display 320x240 16 bit colour with LED and photoresistor 3 Lead Plastic Package OnSemi CASE 100CY, light-direction upwards, see http://www.everlight.com/file/ProductFile/ITR8307.pdf refective opto couple photo coupler package for Everlight ITR8307/F43, see https://everlighteurope.com/index.php?controller=attachment&id_attachment=5385 package for Everlight ITR1201SR10AR, light-direction upwards, see http://www.onsemi.com/pub/Collateral/QRE1113-D.PDF PhotoDiode, plastic SMD DIL, 4.5x4mm, area: 2.65x2.65mm, https://dammedia.osram.info/media/resource/hires/osram-dam-5467144/SFH%202430_EN.pdf PhotoDiode, plastic SMD SmatDIL PhotoDiode plastic SMD SmatDIL PhotoDiode plastic DIL RM5.08 PhotoTransistor, sidelooker package, RM2.54 PhotoTransistor sidelooker package RM2.54 package for Kodenshi SG-105 with PCB locator, 14 Pins per row (https://cdn.harwin.com/pdfs/M20-781.pdf), generated with kicad-footprint-generator Molex SPOX Connector System, 43045-0200 (alternative finishes: 43045-180x), 9 Pins per row (https://cdn.harwin.com/pdfs/M20-781.pdf), generated with kicad-footprint-generator ipc_noLead_generator.py LQFN, 10 Pin (https://www.st.com/resource/en/datasheet/lps25hb.pdf#page=46), generated with kicad-footprint-generator Mounting Hardware, inside through hole 3.3mm, height 1, Wuerth electronics 9774020943 (https://katalog.we-online.de/em/datasheet/9774020943.pdf), generated with kicad-footprint-generator ipc_gullwing_generator.py SOP, 18 Pin (JEDEC MO-153 Var JA https://www.jedec.org/document_search?search_api_views_fulltext=MO-153), generated with kicad-footprint-generator ipc_gullwing_generator.py SOIC, 16 Pin (http://www.analog.com/media/en/technical-documentation/data-sheets/LTC7810.pdf), generated with kicad-footprint-generator ipc_noLead_generator.py VQFN, 32 Pin (https://www.ti.com/lit/ds/slvs589d/slvs589d.pdf#page=33), generated with kicad-footprint-generator ipc_gullwing_generator.py TSSOP, 36 Pin (JEDEC MO-153 Var HC https://www.jedec.org/document_search?search_api_views_fulltext=MO-153), generated with kicad-footprint-generator ipc_gullwing_generator.py SSOP48: plastic shrink small outline package; 44 leads; body width 4.4 mm; thermal pad 3x2mm Pitch 0.5mm Analog Devices (Linear Tech), 133-pin BGA uModule, 15.0x15.0x4.92mm, https://www.analog.com/media/en/technical-documentation/data-sheets/4637fc.pdf MAPBGA 9x9x1.11 PKG, 9.0x9.0mm, 272 Ball, 17x17 Layout, 0.8mm Pitch, https://www.micron.com/-/media/client/global/documents/products/data-sheet/dram/ddr3/4gb_ddr3l.pdf#page=28 FBGA-96, 14.0x9.0mm, 96 Ball, 9x16 Layout, 0.8mm Pitch, https://www.micron.com/-/media/client/global/documents/products/data-sheet/dram/ddr3/4gb_ddr3l.pdf#page=23 FBGA-96, 13.5x7.5mm, 96 Ball, 9x16 Layout, 0.8mm Pitch, https://www.st.com/resource/en/datasheet/stm32mp151a.pdf ST LFBGA-448, 18.0x18.0mm, 448 Ball, 22x22 Layout, 0.8mm Pitch, https://www.st.com/resource/en/datasheet/stm32mp151a.pdf ST TFBGA-225, 13.0x13.0mm, 225 Ball, 15x15 Layout, 0.8mm Pitch, https://www.micron.com/-/media/client/global/documents/products/data-sheet/dram/ddr3/4gb_ddr3l.pdf#page=26 ST uTFBGA-36, 0.25mm pad, 3.6x3.6mm, 36 Ball, 6x6 Layout, 0.5mm Pitch, DSC0010J, WSON, http://www.ti.com/lit/ds/symlink/tps61201.pdf Plastic Small Outline (SSO/Stretched SO), see https://www.vishay.com/docs/84299/vor1142b4.pdf SSO Stretched SO SOIC 2.54 8-Lead Plastic DFN (3mm x 3mm); Pitch 0.4mm; EP 1.7x1.54mm; for InvenSense motion sensors; Mask removed below exposed pad; keepout area marked (Package see: https://store.invensense.com/datasheets/invensense/MPU9250REV1.0.pdf; See also https://www.invensense.com/wp-content/uploads/2015/02/InvenSense-MEMS-Handling.pdf 24-Lead Plastic QFN (4mm x 4mm); Pitch 0.5mm; EP 2.7x2.6mm; for InvenSense motion sensors; Mask removed below exposed pad; keepout area marked (Package see: https://store.invensense.com/datasheets/invensense/MPU-6050_DataSheet_V3%204.pdf; See also https://www.invensense.com/wp-content/uploads/2015/02/InvenSense-MEMS-Handling.pdf 24-Lead Plastic QFN (4mm x 3mm) (http://pdfserv.maximintegrated.com/land_patterns/90-0063.PDF 14-lead very thin plastic quad flat, 3.0x4.5mm size, 0.65mm pitch (http://cache.freescale.com/files/shared/doc/package_info/98ASS23330W.pdf, http://www.nxp.com/docs/en/application-note/AN4388.pdf PQFP, 132 pins, 24mm sq body, 0.65mm pitch (http://ww1.microchip.com/downloads/en/DeviceDoc/14L_VDFN_4_5x3_0mm_JHA_C041198A.pdf DE Package; 16-Lead Plastic DFN (7mm x 4mm) (see Linear Technology DFN_24_05-08-1864.pdf DKD Package; 32-Lead Plastic.

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