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Body [SOIC] (https://docs.broadcom.com/docs/AV02-0169EN SOIC 1.27 16 12 Wide 16-Lead Plastic HTSSOP (4.4x5x1.2mm); Thermal pad with vias; (http://www.ti.com/lit/ds/symlink/drv8800.pdf HTSSOP.

• Normal -0.338901 0.181187 0.92321 vertex -5.00013 7.48323.
• Vertex -9.259156e+01 1.042646e+02 2.655000e+01 facet normal -0.331809 0.353578.
• Count, 1-10 steps possible (with 2-3.

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