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2.39x2.39mm, 16 Ball, 4x4 Layout, 0.5mm Pitch, http://www.ti.com/lit/ds/symlink/txb0104.pdf, http://www.ti.com/lit/an/snva009ag/snva009ag.pdf BGA 12 0.5 R-XBGA-N12 Texas Instruments, DSBGA, 1.36x1.86mm, 12 bump 3x4 (perimeter) array, NSMD pad definition Appendix A Spartan-7 BGA, 18x18 grid, 15x15mm package, 0.8mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=268, NSMD pad definition Appendix A Kintex-7 BGA, 30x30 grid, 31x31mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug865-Zynq-7000-Pkg-Pinout.pdf#page=93, NSMD pad definition (http://www.ti.com/lit/ds/symlink/lm4990.pdf, http://www.ti.com/lit/an/snva009ag/snva009ag.pdf Texas Instruments HSOP 9, 1.27mm pitch, single row Through hole socket strip THT 2x28 2.54mm double row Through hole straight socket strip, 1x33, 2.00mm pitch, 6.35mm socket length, single row style2 pin1 right Through hole angled socket strip SMD 1x05 2.00mm single row Surface mounted socket strip THT 1x10 1.00mm single row style1 pin1 left Surface mounted pin header THT 1x05 2.00mm single row Surface mounted socket strip SMD 2x07 1.00mm double row Through hole angled socket strip, 2x08, 2.54mm pitch, DIN 41651 / IEC 60603-13, double rows, https://docs.google.com/spreadsheets/d/16SsEcesNF15N3Lb4niX7dcUr-NY5_MFPQhobNuNppn4/edit#gid=0 Through hole angled pin header, 2x02, 1.27mm pitch, double rows Surface mounted pin header THT 2x08 2.54mm double row Through hole straight pin header, 2x25, 1.00mm pitch, single row Surface mounted pin header THT 2x17 2.00mm double row surface-mounted straight pin header, 2x17, 2.54mm pitch, 8.51mm socket length, double.

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