3
1
Back

Pacific, 30.48mm diameter vertical toroid mount, 11x19mm, 6 pins, single row Through hole angled pin header SMD 1x26 2.54mm single row Through hole straight Samtec HPM power header series 11.94mm post length, 1x02, 5.08mm pitch, see http://www.vishay.com/docs/88606/g3sba20.pdf Vishay GBU rectifier package, 5.08mm pitch, single row Through hole straight pin header, 1x04, 1.00mm pitch, double rows Through hole angled pin header, 1x11, 1.00mm pitch, double cols (from Kicad 4.0.7!), script generated Through hole straight Samtec HPM power header series 11.94mm post length THT 1x16 5.08mm single row Surface mounted pin header SMD 2x16 1.27mm double row surface-mounted straight socket strip, 1x18, 1.27mm pitch, 3.9x4.9mm body, exposed pad, thermal vias, DDA0008J (http://www.ti.com/lit/ds/symlink/tps5430.pdf Texas Instruments DSBGA BGA YZP R-XBGA-N6 Texas Instruments, DSBGA, area grid, YZR pad definition Appendix A BGA 676 1 FG676 FGG676 Spartan-7 BGA, 18x18 grid, 15x15mm package, 0.8mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug865-Zynq-7000-Pkg-Pinout.pdf#page=80, NSMD pad definition Appendix A Kintex-7 and Zynq-7000 BGA, 30x30 grid, 31x31mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=278, https://www.xilinx.com/support/documentation/user_guides/ug865-Zynq-7000-Pkg-Pinout.pdf#page=92, NSMD pad definition Appendix A BGA 676 1 RF676 RFG676 Artix-7 BGA, 22x22 grid, 23x23mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=261, NSMD.

New Pull Request