synth_tools

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Pad (see https://www.diodes.com/assets/Datasheets/AP2204.pdf SSOP 0.50 exposed pad (https://www.infineon.com/cms/en/product/packages/PG-DSO/PG-DSO-20-85/ Infineon SO package 20pin without exposed pad 4.5x7mm (https://www.infineon.com/cms/en/product/packages/PG-DSO/PG-DSO-20-71/ Infineon SO package 20pin with exposed pad 8-Lead Plastic PSOP, Exposed Die Pad (see https://www.diodes.com/assets/Datasheets/AP2204.pdf SSOP 0.50 exposed pad (https://www.infineon.com/cms/en/product/packages/PG-DSO/PG-DSO-20-32/ Infineon SO package 20pin with exposed pad Micrel MLF, 8 Pin (http://ww1.microchip.com/downloads/en/DeviceDoc/20005045C.pdf#page=23), generated with kicad-footprint-generator ipc_noLead_generator.py Analog LFCSP-UQ, 10 Pin (http://www.ti.com/lit/gpn/tps63030#page=24), generated with kicad-footprint-generator Molex Picoflex Ribbon-Cable Connectors, 90814-0010, 10 Pins per row (http://www.molex.com/pdm_docs/sd/431600105_sd.pdf), generated with kicad-footprint-generator JST EH series connector, B06B-J21DK-GGXR (http://www.jst-mfg.com/product/pdf/eng/eJFA-J2000.pdf), generated with kicad-footprint-generator Mounting Hardware, inside through hole M3, height 9, Wuerth electronics 9774050360 (https://katalog.we-online.de/em/datasheet/9774050360.pdf), generated with kicad-footprint-generator ipc_noLead_generator.py LFCSP, 24 Pin (http://www.cypress.com/file/46236/download), generated with kicad-footprint-generator Samtec HLE .100" Tiger Beam Cost-effective Single Beam Socket Strip, HLE-118-02-xxx-DV-BE-A, 18 Pins (https://www.molex.com/pdm_docs/sd/026605050_sd.pdf), generated with kicad-footprint-generator Samtec HLE .100" Tiger Beam Cost-effective Single Beam Socket Strip, HLE-145-02-xx-DV-TE, 45 Pins per row (http://www.molex.com/pdm_docs/sd/428202214_sd.pdf), generated with kicad-footprint-generator ipc_noLead_generator.py QFN, 40 Pin (https://www.analog.com/media/en/package-pcb-resources/package/pkg_pdf/lfcspcp/cp-40/CP_40_15.pdf), generated with kicad-footprint-generator ipc_gullwing_generator.py 20-Lead Plastic Quad Flat, No Lead Package (MC) - 2x3x0.9 mm Body [TSSOP] with exposed pad (https://www.infineon.com/cms/en/product/packages/PG-DSO/PG-DSO-20-32/ Infineon SO package 20pin with exposed pad 8-Lead Plastic VSON, 3x3mm Body, 0.5mm Pitch, https://www.nxp.com/docs/en/package-information/98ASA00869D.pdf#page=1 MAPBGA 14x14x1.18 PKG, 14.0x14.0mm, 289 Ball, 17x17 Layout, 0.8mm Pitch, https://www.micron.com/-/media/client/global/documents/products/data-sheet/dram/ddr3/4gb_ddr3l.pdf#page=27 FBGA-96, 14.0x8.0mm, 96 Ball, 9x16 Layout, 0.8mm Pitch, https://www.micron.com/-/media/client/global/documents/products/data-sheet/dram/ddr3/4gb_ddr3l.pdf#page=26 ST uTFBGA-36, 0.25mm pad, 3.6x3.6mm, 36 Ball, 6x6 Layout, 0.4mm Pitch, https://pdfserv.maximintegrated.com/package_dwgs/21-100168.PDF XBGA-121, 11x11 raster, 10x10mm package, 0.5mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=267, NSMD pad definition Appendix A BGA 1760 1 FH1761 FHG1761 Virtex-7 BGA, 42x42 grid, 42.5x42.5mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=264, NSMD pad definition Appendix A Artix-7 BGA, 16x16 grid, 17x17mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=261, NSMD pad definition (http://www.ti.com/lit/ds/slas718g/slas718g.pdf, http://www.ti.com/lit/an/snva009ag/snva009ag.pdf Texas Instruments, DSBGA, 3.0x1.9x0.625mm, 28 ball 7x4 area grid, YBJ0008 pad definition, 1.468x0.705mm, 8 Ball, 2x4 Layout, 0.4mm Pitch, https://www.st.com/resource/en/datasheet/stm32l412t8.pdf ST WLCSP-49, ST die ID 479, 3.56x3.52mm, 64 Ball, 8x8 Layout, 0.4mm Pitch, https://www.st.com/resource/en/datasheet/stm32g491re.pdf ST WLCSP-81, ST die ID 468, 3.15x3.13mm, 49 Ball, 7x7 Layout, 0.4mm Pitch, https://pdfserv.maximintegrated.com/package_dwgs/21-100489.PDF WLCSP-25, 5x5 raster, 2.133x2.070mm.

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