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VFBGA-100, 10x10, 7x7mm package, pitch 0.8mm; http://ww1.microchip.com/downloads/en/PackagingSpec/00000049BQ.pdf#p495 TFBGA-216, 15x15 raster, 10x10mm package, pitch 0.4mm; see section 7.5 of http://www.st.com/resource/en/datasheet/stm32l152ze.pdf WLCSP-143, 11x13 raster, 4.539x5.849mm package, pitch 0.4mm; see section 6.6 of http://www.st.com/resource/en/datasheet/DM00273119.pdf X1-WLB0909, 0.89x0.89mm, 4 Ball, 2x2 Layout, 0.35mm Pitch, https://www.onsemi.com/pdf/datasheet/ncp163-d.pdf#page=23 6pin Pitch 0.4mm http://www.chip.tomsk.ru/chip/chipdoc.nsf/Package/C67E729A4D6C883A4725793E004C8739!OpenDocument WSON-16 3.3 x 1.35mm Pitch 0.4mm WLCSP WLCSP/XFBGA 8-pin package, staggered pins, http://www.adestotech.com/wp-content/uploads/DS-AT25DF041B_040.pdf WLCSP WLCSP-8 XFBGA XFBGA-8 CSP BGA Chip-Scale Glass-Top WLCSP-8, 2.284x1.551mm, 8 Ball, 2x4 Layout, 0.5mm Pitch, 0.3mm Ball, http://www.st.com/resource/en/datasheet/stm32l486qg.pdf UFBGA-144, 12x12 raster, 7x7mm package, pitch 0.8mm; see section 7.2 of http://www.st.com/resource/en/datasheet/stm32f429ng.pdf UFBGA-201, 15x15 raster, 10x10mm package, pitch 0.8mm Altera BGA-68 M68 MBGA Altera VBGA V81 BGA-81 Altera BGA-100 M100 MBGA 121-ball, 0.8mm BGA (based on http://www.latticesemi.com/view_document?document_id=213 BGA 0.8mm 9mm 121 BGA-132 11x17 12x18mm 1.0pitch Altera BGA-144 M144 MBGA Altera VBGA V81 BGA-81 Altera BGA-100 M100 MBGA 121-ball, 0.8mm BGA (based on standard DIP-4), row spacing 7.62 mm (300 mils), Socket 40-lead though-hole mounted DIP package, row spacing 5.25 mm (206 mils), body size 6.7x6.64mm (see e.g. Https://www.ctscorp.com/wp-content/uploads/206-208.pdf 3x-dip-switch SPST , Slide, row spacing 10.16 mm (400 mils), LongPads 18-lead though-hole mounted DIP package, row spacing 5.25 mm (206 mils), body size (see http://www.kingtek.net.cn/pic/201601201446313350.pdf), JPin SMD 8x-dip-switch SPST KingTek_DSHP08TJ, Slide, row spacing 7.62 mm (300 mils), Socket THT DIP DIL PDIP 2.54mm 7.62mm 300mil 1x-dip-switch SPST , Slide, row spacing 7.62 mm (300 mils), Socket, LongPads 8-lead though-hole mounted DIP package, row spacing 8.89 mm (350 mils), body size (see http://www.kingtek.net.cn/pic/201601201446313350.pdf), JPin SMD 2x-dip-switch SPST , Slide, row spacing 9.53 mm (375 mils 32-lead surface-mounted (SMD) DIP package, row spacing 7.62 mm (300 mils), http://multimedia.3m.com/mws/media/494546O/3mtm-dip-sockets-100-2-54-mm-ts0365.pdf 3M 18-pin zero insertion force socket, through-hole, row spacing 7.62 mm (300 mils), body size 9.78x12.34mm (see e.g. Https://www.ctscorp.com/wp-content/uploads/209-210.pdf), LowProfile 7x-dip-switch SPST , Slide, row spacing 8.61 mm (338 mils), body size (see http://www.kingtek.net.cn/pic/201601201417455112.pdf SMD 5x-dip-switch SPST KingTek_DSHP05TS, Slide, row spacing 15.24 mm (600 mils), LongPads 12-lead though-hole mounted DIP package, row spacing 15.24 mm (600 mils), Socket 64-lead though-hole mounted DIP package, row spacing 9.53 mm (375 mils 10-lead surface-mounted (SMD) DIP package, row spacing 8.61 mm (338 mils), body size 6.7x4.1mm (see e.g. Https://www.ctscorp.com/wp-content/uploads/209-210.pdf), LowProfile 6x-dip-switch SPST , Slide, row spacing 25.4 mm (1000 mils), SMDSocket, SmallPads 42-lead though-hole mounted DIP package, row spacing 11.48 mm (451 mils 22-lead though-hole mounted DIP package, row.

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