Labels Milestones
BackIM-10-37, http://www.vishay.com/docs/34030/im10.pdf Inductor Axial series Axial Horizontal pin pitch 1.9mm 0.167W length 3.6mm diameter 1.6mm Resistor, Axial_DIN0204 series, Axial, Horizontal, pin pitch=11.4mm, 1W, length*width=12.4*4.8mm^2, https://www.bourns.com/pdfs/PWR4412-2S.pdf Resistor Bare_Metal_Element series Bare Metal Strip Wire Horizontal pin pitch 10.00mm length 11.5mm width 4.0mm Resistor, Box series, Radial, pin pitch=5.00mm, , diameter=10.5mm, Tantal Electrolytic Capacitor CP, Radial series, Radial, pin pitch=22.50mm, , length*width=26.5*11.5mm^2, Capacitor, http://www.wima.com/EN/WIMA_MKS_4.pdf C Rect series Radial pin pitch 2.54mm size 13.2x6.2mm^2 drill 1.1mm pad 2.1mm terminal block RND 205-00032, 11 pins, pitch 2.54mm, package size 11.6x8.5x10.4mm^3, https://www.recom-power.com/pdf/Innoline/R-78Exx-0.5.pdf DCDC-Converter, RECOM, RECOM_R-78E-0.5, SIP-3, pitch 2.54mm, size 20.78x6.5mm^2, drill diamater 1.2mm, pad diameter 2.5mm, see http://cdn-reichelt.de/documents/datenblatt/C151/RND_205-00276_DB_EN.pdf, script-generated with , script-generated with , script-generated using https://github.com/pointhi/kicad-footprint-generator/scripts/TerminalBlock_RND THT terminal block RND 205-00003, 4 pins, pitch 5mm, size 37.3x14mm^2, drill diamater 1.3mm, pad diameter 3mm, size source Multi-Contact FLEXI-xV 2.0 (https://ec.staubli.com/AcroFiles/Catalogues/TM_Cab-Main-11014119_(en)_hi.pdf), bend radius 3 times outer diameter, generated with kicad-footprint-generator Molex SlimStack Fine-Pitch SMT Board-to-Board Connectors, 502426-1410, 14 Pins (http://www.molex.com/pdm_docs/sd/559320530_sd.pdf), generated with kicad-footprint-generator Molex KK 396 Interconnect System, old/engineering part number: 22-27-2151, 15 Pins per row (https://www.molex.com/pdm_docs/sd/022057045_sd.pdf), generated with kicad-footprint-generator Hirose FH12, FFC/FPC connector, FH12-53S-0.5SH, 53 Pins per row (http://suddendocs.samtec.com/prints/hle-1xx-02-xxx-dv-xx-xx-xx-mkt.pdf, http://suddendocs.samtec.com/prints/hle-dv-footprint.pdf), generated with kicad-footprint-generator JST PH series connector, B7B-XH-A (http://www.jst-mfg.com/product/pdf/eng/eXH.pdf), generated with kicad-footprint-generator ipc_gullwing_generator.py 20-Lead Plastic Quad Flat, No Lead Package (MD) - 4x4x0.9 mm Body (http://ww1.microchip.com/downloads/en/DeviceDoc/20005010F.pdf 8-Lead Plastic PSOP, Exposed Die Pad (TI DDA0008B, see http://www.ti.com/lit/ds/symlink/lm3404.pdf 8-pin HTSOP package with 1.27mm pin pitch, compatible with SOIC-8, 3.9x4.9mm body, exposed pad, 4x4mm body, pitch 0.5mm (http://www.analog.com/media/en/package-pcb-resources/package/56702234806764cp_24_3.pdf, http://www.analog.com/media/en/technical-documentation/data-sheets/ADL5801.pdf LFCSP VQ, 48 pin, exposed pad, thermal vias, http://www.ti.com/lit/ds/symlink/drv8870.pdf 20-Pin Thermally Enhanced Thin Shrink Small Outline (SO), see https://docs.broadcom.com/docs/AV02-0173EN 4-Lead Plastic QFN (3mm x 2mm) 0.40mm pitch DDB Package; 10-Lead Plastic Dual Flat, No Lead Package (MD) - 4x4x0.9 mm Body [QFN] with corner pads and trace routing to de-bodge the pots. 's notes on repique/caixa, two or three for surdos