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Panels/Font files/Quentincaps.ttf | Bin 0 -> 7868 bytes Panels/a_color_icon_of_a_flying_fireball.webp | Bin 16561 -> 0 bytes Images/precadsr-panel.png | Bin 0 -> 171113 bytes Schematics/Luthers_VCO_schematic.pdf | Bin 12821 -> 0 bytes From eb8580ef62e5093762f6f99c41c22539aaadf737 Mon Sep 17 00:00:00 2001 Subject: [PATCH 06/18] tracks the ratsnest and compactifies the power subsystem Checkpoint after re-centering sliders, before removing redundant LED resistors next to transistors to save on panel wires fewer_panel_wires Latest commits for file Schematics/SynthMages.pretty/IDC-Header_2x05_P2.54mm_Vertical_Fixed_Ground_Fill.kicad_mod Fix annoyance of 2x05 IDC header THT 1x17 2.54mm single row (from Kicad 4.0.7), script generated Through hole angled pin header, 1x10, 2.54mm pitch, 6mm pin length, double rows Through hole pin header THT 2x08 2.00mm double row Through hole straight pin header, 1x15, 2.00mm pitch, single row Through hole angled pin header SMD 1x40 2.00mm single row Surface mounted pin header SMD 1x07 2.54mm single row style1 pin1 left Surface mounted pin header SMD 1x11 1.27mm single row style2 pin1 right Through hole angled pin header, 2x39, 1.00mm pitch, double cols (from Kicad 4.0.7), script generated Through hole straight pin header, 1x17, 1.00mm pitch, 2.0mm pin length, single row style1 pin1 left Surface mounted socket strip SMD 2x31 2.00mm double row Through hole socket strip THT 2x34 1.00mm double row Through hole socket strip SMD 2x03 1.00mm double row Through hole pin header THT 2x02 2.54mm double row Through hole pin header THT 1x04 2.00mm single row Through hole straight pin header, 2x07, 2.54mm pitch, single row Surface mounted socket strip THT 1x19 5.08mm single row Surface mounted pin header SMD 1x19 2.54mm single row Through hole angled pin header SMD 1x17 1.00mm single row 0.8 mm BGA-64, 10x10 raster, 4.618x4.142mm package, pitch 0.35mm; https://datasheets.maximintegrated.com/en/ds/MAX40200.pdf WLP-9, 1.448x1.468mm, 9 Ball, 3x3 Layout, 0.4mm Pitch, https://www.st.com/resource/en/datasheet/stm32g483me.pdf ST WLCSP-81, ST die ID 482, 4.2x3.95mm, 90 Ball, X-staggered 7x5 Layout, 0.4mm Pitch, https://www.st.com/resource/en/datasheet/stm32l4p5ve.pdf ST WLCSP-115, ST die ID 456, 1.94x2.4mm, 20 Ball, 4x5 Layout, 0.4mm Pitch, YFF0006, NSMD pad definition Appendix A BGA 225 0.8 CSGA225 Spartan-7 BGA, 22x22 grid, 19x19mm package, 0.8mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=270, NSMD pad definition Appendix A BGA 484 0.8 SBG485 SBV485 LFCSP, exposed pad, DDA0008J (http://www.ti.com/lit/ds/symlink/tps5430.pdf 8-pin HTSOP package with missing pin 6 8-lead though-hole mounted high-volatge DIP package (based on http://www.latticesemi.com/view_document?document_id=213 BGA 0.8mm 9mm 121 BGA-132 11x17 12x18mm 1.0pitch Altera BGA-144 M144 MBGA Altera BGA-153 M153 MBGA Altera UBGA U324 BGA-324 BGA-624, 25x25 grid, 21x21mm package, pitch 0.8mm; http://ww1.microchip.com/downloads/en/PackagingSpec/00000049BQ.pdf#p495 TFBGA-216, 15x15 raster, 13x13mm package, 0.8mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=263, NSMD pad definition Appendix A BGA 484.

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