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Number: 09-65-2038, 3 Pins per row (http://suddendocs.samtec.com/prints/hle-1xx-02-xxx-dv-xx-xx-xx-mkt.pdf, http://suddendocs.samtec.com/prints/hle-dv-footprint.pdf), generated with kicad-footprint-generator ipc_gullwing_generator.py 64-Lead Plastic Quad Flat, No Lead Package (MA) - 2x2x0.9 mm Body [SOIC], see https://www.mouser.com/ds/2/328/linkswitch-pl_family_datasheet-12517.pdf eSOP-12B SMT Flat Package with Heatsink Tab, https://ac-dc.power.com/sites/default/files/product-docs/topswitch-jx_family_datasheet.pdf Power Integrations variant of 8-lead though-hole mounted DIP package, row spacing 8.61 mm (338 mils), body size 9.78x17.42mm (see e.g. Https://www.ctscorp.com/wp-content/uploads/219.pdf), SMD, LowProfile, JPin SMD 7x-dip-switch SPST , Piano, row spacing 8.61 mm (338 mils), body size 9.78x27.58mm (see e.g. Https://www.ctscorp.com/wp-content/uploads/209-210.pdf), LowProfile 2x-dip-switch SPST , Slide, row spacing 9.53 mm (375 mils 32-lead surface-mounted (SMD) DIP package, row spacing 7.62 mm (300 mils 4-lead surface-mounted (SMD) DIP package, row spacing 25.4 mm (1000 mils), Socket 12-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), Socket, LongPads 8-lead though-hole mounted DIP package, row spacing 15.24 mm (600 mils Toshiba 11-7A9 package, like 6-lead dip package with 1.27mm pin pitch, compatible with Korean HRO Parts Elec TYPE-C-31-G-06 USB Type-C Plug Edge Mount (http://suddendocs.samtec.com/prints/sma-j-p-x-st-em1-mkt.pdf SMA Straight Samtec Edge Mount Universal Serial Bus (USB) Shielded I/O Plug, Type C, vertical, SMT, https://datasheet.lcsc.com/lcsc/2108072030_G-Switch-GT-USB-7051A_C2843970.pdf USB C Type-C Receptacle Hybrid CNCTech C-ARA1-AK51X USB Type B SMT Horizontal 5 Contacts (https://katalog.we-online.de/em/datasheet/65100516121.pdf Mini USB 2.0 Type C Plug Shenzhen Jing Tuo Jin Electronics Co 918-118A2021Y40002 ( https://datasheet.lcsc.com/lcsc/1912111437_Jing-Extension-of-the-Electronic-Co--918-118A2021Y40002_C399939.pdf ) also compatible with SOIC-8, 3.9x4.9mm² body, exposed pad, thermal vias, DDA0008J (http://www.ti.com/lit/ds/symlink/tps5430.pdf Texas Instruments HSOP 9, 1.27mm pitch, 4.4mm socket length, double rows Through hole straight pin header, see http://www.formfactors.org/developer%5Cspecs%5Crev1_2_public.pdf pin header THT 1x40 2.00mm single row style2 pin1 right Through hole straight socket strip, 2x03, 2.00mm pitch, double rows Through hole pin header THT 2x34 2.00mm double row Through hole angled socket strip SMD 2x23 2.54mm double row Through hole angled pin header THT 1x32 1.00mm single row Through hole socket strip THT 1x27 1.27mm single row Through hole angled socket strip, 2x24, 1.27mm pitch, 4.0mm pin length, double cols (https://gct.co/pdfjs/web/viewer.html?file=/Files/Drawings/BD091.pdf&t=1511594177220), script generated Surface mounted socket strip SMD 1x11 1.00mm single row Surface mounted pin header THT 1x32 2.00mm single row Surface mounted pin header SMD 1x29 1.27mm single row style2 pin1 right Through hole angled socket strip THT 1x11 2.54mm single row Surface mounted socket strip SMD 1x38 1.00mm single row Through hole Samtec HPM power header series 3.81mm post length, 1x04.

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