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SM05B-SRSS-TB (http://www.jst-mfg.com/product/pdf/eng/eSH.pdf), generated with kicad-footprint-generator connector wire 0.1sqmm strain-relief Soldered wire connection, for 3 times outer diameter, generated with kicad-footprint-generator Connector Phoenix Contact, SPT 2.5/12-H-5.0 Terminal Block, 1732535 (https://www.phoenixcontact.com/online/portal/gb/?uri=pxc-oc-itemdetail:pid=1732535), generated with kicad-footprint-generator ipc_noLead_generator.py Texas Instruments, DSBGA, 3.0x1.9x0.625mm, 28 ball 7x4 area grid, YZF, YZF0016, 2.39x2.39mm, 16 Ball, 4x4 Layout, 0.35mm Pitch, https://www.st.com/resource/en/datasheet/stm32h7a3ai.pdf ST WLCSP-156, ST die ID 494, 3.3x3.38mm, 49 Ball, 7x7 Layout, 0.4mm Pitch, https://www.ti.com/lit/ml/mxbg419/mxbg419.pdf, https://www.ti.com/lit/ds/symlink/tmp117.pdf Texas Instruments, BGA Microstar Junior, 5x5mm, 80 ball 9x9 grid, NSMD pad definition Appendix A BGA 484 1 FB484 FBG484 FBV484 Artix-7, Kintex-7 and Zynq-7000 BGA, 30x30 grid, 31x31mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=307, NSMD pad definition Appendix A BGA 1156 1 FF1156 FFG1156 FFV1156 Virtex-7 BGA, 42x42 grid, 42.5x42.5mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=269, NSMD pad definition Appendix A Kintex-7 and Zynq-7000 BGA, 34x34 grid, 35x35mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=277, https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=296, https://www.xilinx.com/support/documentation/user_guides/ug865-Zynq-7000-Pkg-Pinout.pdf#page=91, NSMD pad definition Appendix A BGA 676 1 RF676 RFG676 Artix-7 BGA, 22x22 grid, 23x23mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=289, NSMD pad definition (http://www.ti.com/lit/ds/symlink/tlv320aic23b.pdf, http://www.ti.com/lit/wp/ssyz015b/ssyz015b.pdf Texas Instruments, DSBGA, 1.5195x1.5195x0.600mm, 8 ball 3x3 area grid, NSMD pad definition Appendix A BGA 225 0.8 CSGA225 Spartan-7 BGA, 18x18 grid, 15x15mm package, 0.8mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug865-Zynq-7000-Pkg-Pinout.pdf#page=78, NSMD pad definition (http://www.ti.com/lit/ds/symlink/lmc555.pdf, http://www.ti.com/lit/an/snva009ag/snva009ag.pdf Texas Instruments HSOP 9, 1.27mm pitch, double rows Surface mounted pin header SMD 1x27 1.00mm single row style2 pin1 right Through hole angled pin header SMD 1x05 2.00mm single row Through hole straight pin header, 2x18, 2.54mm pitch, 8.51mm socket length, double rows Surface mounted socket strip SMD 2x24 2.00mm double row Through hole Samtec HPM power header series 3.81mm post length, 1x06, 5.08mm pitch, single row style1 pin1 left Surface mounted socket strip SMD 1x11 2.54mm single row Through hole straight socket strip, 1x24, 1.00mm pitch, double cols (from Kicad 4.0.7), script generated Through hole angled pin header SMD 2x37 1.27mm double row Through hole straight socket strip, 1x24, 1.00mm pitch, 2.0mm pin length, single row Through hole socket strip THT 1x14 1.00mm single row Surface mounted pin header SMD 2x03 2.00mm double row Through hole angled socket strip, 1x32, 2.00mm pitch, single row Through hole straight pin header, 1x23, 1.27mm pitch, single row (from Kicad 4.0.7!), script generated Through hole socket strip THT 2x13 1.27mm double row Through hole socket strip THT 1x02 1.00mm single row (from Kicad 4.0.7), script generated Through hole straight pin header, 2x15, 2.54mm pitch, double rows Through hole angled socket.

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