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4-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), LongPads 8-lead though-hole mounted DIP package, row spacing 9.53 mm (375 mils), Clearance8mm 20-lead surface-mounted (SMD) DIP package, row spacing 11.48 mm (451 mils 24-lead surface-mounted.

• Operational Amplifiers, DIP-14/SOIC-14 .
• Molex MicroClasp Wire-to-Board System, 55935-1310, with PCB locator.
• Circular Fiducial fiducial 0 1 0 PCM_kikit.
• 2.5mm solder Pin_ diameter 1.3mm, length 11.3mm.

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