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Ball 8x8 area grid, YBG pad definition, 1.468x0.705mm, 8 Ball, 2x4 Layout, 0.5mm Pitch, https://www.st.com/resource/en/datasheet/stm32mp151a.pdf ST TFBGA-361, 12.0x12.0mm, 361 Ball, 23x23 Layout, 0.5mm Pitch, https://www.nxp.com/docs/en/package-information/98ASA00869D.pdf#page=1 MAPBGA 14x14x1.18 PKG, 14.0x14.0mm, 289 Ball, 17x17 Layout, 0.5mm Pitch, S-PWSON-N10, DSC, http://www.ti.com/lit/ds/symlink/tps63060.pdf USON-10 2.5x1.0mm_ Pitch 0.5mm SON, 8-Leads, Body 5x6x1mm, Pitch 1.27mm; (see Texas Instruments HSOP 9, 1.27mm pitch, single row (from Kicad 4.0.7), script generated Through hole angled socket strip THT 1x25 2.54mm single row Through hole straight socket strip, 2x17, 2.54mm pitch, double cols (from Kicad 4.0.7), script generated Through hole angled pin header SMD 2x36 2.54mm double row Through hole angled pin header, 2x05, 2.54mm pitch, 8.51mm socket length, double rows Surface mounted socket strip THT 2x21 1.00mm double row Through hole IDC header, 2x07, 1.00mm pitch, 2.0mm pin length, double rows Through hole straight pin header, 2x30, 2.54mm pitch, DIN 41651 / IEC 60603-13, double rows, 12.0mm latches, mounting holes, https://docs.google.com/spreadsheets/d/16SsEcesNF15N3Lb4niX7dcUr-NY5_MFPQhobNuNppn4/edit#gid=0 Through hole straight socket strip, 2x24, 2.54mm pitch, double rows Surface mounted pin header SMD 2x32 1.27mm double row Through hole.

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