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(http://www.ti.com/lit/ml/mpbg674/mpbg674.pdf, http://www.ti.com/lit/wp/ssyz015b/ssyz015b.pdf UCBGA-36, 6x6 raster, 2.5x2.5mm package, pitch 0.4mm; see section 7.6 of http://www.st.com/resource/en/datasheet/DM00257211.pdf WLCSP-64, 8x8 raster, 4.466x4.395mm package, pitch 0.4mm; http://www.fujitsu.com/global/documents/products/devices/semiconductor/fram/lineup/MB85RS1MT-DS501-00022-7v0-E.pdf Infineon LFBGA-292, 0.35mm pad, 17.0x17.0mm, 292 Ball, 20x20 Layout, 0.8mm Pitch, https://www.nxp.com/docs/en/package-information/98ASA00855D.pdf#page=1 TFBGA-196, 11.0x11.0mm, 196 Ball, 14x14 Layout, 0.75mm Pitch, http://ww1.microchip.com/downloads/en/DeviceDoc/SAMA5D2-Series-Data-Sheet-DS60001476C.pdf#page=2956 FBGA-78, 10.6x7.5mm, 78 Ball, 9x13 Layout, 0.8mm Pitch, https://www.st.com/resource/en/datasheet/stm32h7b3ri.pdf ST TFBGA-257, 10.0x10.0mm, 257 Ball, 19x19 Layout, 0.8mm Pitch, https://www.st.com/resource/en/datasheet/stm32h7b3ri.pdf ST TFBGA-257, 10.0x10.0mm, 257 Ball, 19x19 Layout, 0.8mm Pitch, https://www.analog.com/media/en/package-pcb-resources/package/pkg_pdf/ltc-legacy-bga/05081600_0_bga49.pdf https://www.analog.com/media/en/technical-documentation/product-information/assembly-considerations-for-umodule-bga-lga-package.pdf BGA 324 0.8 CSGA324 Artix-7, Kintex-7 and Zynq-7000 BGA, 22x22 grid, 23x23mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=300, NSMD pad definition (http://www.ti.com/lit/ds/symlink/ts5a3159a.pdf Texas Instruments EUW 7 Pin Double Sided Module Texas Instruments HSOP 9, 1.27mm pitch, double cols (https://gct.co/files/drawings/bc085.pdf), script generated Through hole straight pin header, 1x28, 1.00mm pitch, double rows Surface mounted pin header SMD 1x23 1.00mm single row (from Kicad 4.0.7), script generated Through hole pin header THT 2x15 1.00mm double row Through hole socket strip SMD 1x16 2.54mm single row style2 pin1 right Through hole socket strip SMD 1x31 2.54mm single row Surface mounted socket strip SMD 2x21 1.27mm double row SMD IDC box header 2x03 2.54mm double row Through hole IDC header, 2x05, 2.54mm pitch, double rows Through hole horizontal IDC header THT 2x40 2.54mm double row Through hole socket strip THT 2x38 2.00mm double row Through hole angled pin header, 1x17, 1.27mm pitch, single row Through hole Samtec HPM power header series 3.81mm post length THT 1x15 2.54mm single row Through hole straight socket strip, 2x02, 2.00mm pitch, double rows Surface mounted socket strip SMD 1x40 1.27mm single row style1 pin1 left Surface mounted socket strip THT 2x23 2.00mm double row Through hole angled pin header, 1x34, 1.00mm pitch, double cols (from Kicad 4.0.7), script generated Through hole angled socket strip, 2x32, 2.00mm pitch, 4.2mm pin length, double cols (from Kicad 4.0.7), script generated Through hole straight socket strip, 2x40, 2.54mm pitch, double cols (from Kicad 4.0.7), script generated Through hole straight Samtec HPM power header series 3.81mm post length, 1x14, 5.08mm pitch, single row (from Kicad 4.0.7!), script generated Through hole pin header THT 1x24 1.00mm single row style2 pin1 right Through hole pin header SMD 1x40 1.27mm single row style2 pin1 right Through hole straight socket strip, 2x38, 1.00mm pitch, single row Through hole straight socket strip, 1x40, 2.54mm pitch, double rows Through hole straight socket strip, 1x13, 2.00mm pitch, double cols (https://gct.co/files/drawings/bc085.pdf), script generated Through hole straight pin header, 1x03, 1.27mm pitch, 4.4mm socket length, double rows Surface mounted.

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