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Sockets: // CLOCK in RESET / CASCADE in - glide in (sleeve and normal both GND - Gate out, with probably +12v gates. - Variable step count, 1-10 steps possible (with 2-3 extra switch positions to re-use for frequently-swapped positions). External reset via momentary push button. Play continuously or play once (switch to select segments from each step. Binary files /dev/null and b/KICKDRUM_MANUAL.pdf differ Binary files /dev/null and b/3D Printing/Panels/HOLD PORTAL.png | Bin 0 -> 12724 bytes .../Panels/POLYMORPH.png | Bin 0 -> 140153 bytes create mode 100644 Hardware/PCB/precadsr/Kosmo_panel.pretty/fastestenv_Panel_Mounting_Hole.kicad_mod delete mode 100644 Hardware/Panel/precadsr_panel_al/precadsr_panel_al.pretty/Bigger_Push_Switch_Hole_NPTH.kicad_mod delete mode 100644 Hardware/Panel/precadsr-panel-Gerbers/precadsr-panel.gbrjob create mode 100644 Panels/futura light bt.ttf differ Binary files /dev/null and b/Synth_Manuals/VALMORIFICATION+Build+and+BOM.pdf differ These were used in the Program except as stated in this measurement. // Shape of top of the PCB, with tolerances // th = thickness + 9.5/2 + tolerance*2; //three knobs plus space between two resistors Properly assign potentiometer pads and thermal vias; see section 7.1 of http://www.st.com/resource/en/datasheet/stm32f301r8.pdf WLCSP-49, 7x7 raster, 2.965x2.965mm package, pitch 0.4mm; see section 7.5 of http://www.st.com/resource/en/datasheet/DM00284211.pdf WLCSP-104, 9x12 raster, 4.095x5.094mm package, pitch 0.4mm; see section 7.1 of http://www.st.com/resource/en/datasheet/stm32f103tb.pdf UFBGA-132, 12x12 raster, 5.24x5.24mm package, pitch 0.8mm; http://ww1.microchip.com/downloads/en/PackagingSpec/00000049BQ.pdf#p495 TFBGA-216, 15x15 raster, 10x10mm package, 0.5mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=260, NSMD pad definition Appendix A BGA 484 0.8 CLG484 CL484 CLG485 CL485 Artix-7 BGA, 16x16 grid, 17x17mm package, 0.8mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=268, NSMD pad definition Appendix A BGA 484 1 FG484 FGG484 Artix-7 BGA, 22x22 grid, 23x23mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=261, NSMD pad definition Appendix A BGA 238 0.5 CPG238 Spartan-7 BGA, 18x18 grid, 15x15mm package, 0.8mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=262, NSMD pad definition, 1.468x0.705mm, 8 Ball, 2x4 Layout, 0.4mm Pitch, https://assets.nexperia.com/documents/data-sheet/PCMFXUSB3S_SER.pdf ST WLCSP-18, ST Die ID 466, 1.86x2.14mm, 18 Ball, X-staggered 7x5 Layout, 0.4mm Pitch, https://pdfserv.maximintegrated.com/package_dwgs/21-100302.PDF, https://pdfserv.maximintegrated.com/package_dwgs/21-100302.PDF NXP VFBGA-42, 3.0x2.6mm, 42 Ball, 6x7 Layout, 0.4mm Pitch, https://www.st.com/resource/en/datasheet/stm32l562ce.pdf ST WLCSP-90, ST die ID 482.

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