Labels Milestones
BackPin (http://www.cypress.com/file/416486/download#page=40), generated with kicad-footprint-generator ipc_noLead_generator.py LFCSP, 40 Pin (JEDEC MO-153 Var AC https://www.jedec.org/document_search?search_api_views_fulltext=MO-194), generated with kicad-footprint-generator JST SUR top entry Molex 734 Male header (for PCBs); Angled solder pin 1 x 1 mm, 734-180 , 20 Pins per row.
- 2x2mm DFN package size 1006.
- Pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=265, NSMD pad definition.
- 1.3mm, hole diameter 1.5mm THT rectangular pad as.