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Body, 9.5mm sq thermal pad TSSOP HTSSOP 0.65 thermal pad HTSSOP32: plastic thin shrink small outline package; 28 leads; body width 6.1 mm; lead pitch 0.65 mm (see NXP SSOP-TSSOP-VSO-REFLOW.pdf and sot266-1_po.pdf SSOP, 20 Pin (https://www.ti.com/lit/ds/symlink/ts3ds10224.pdf#page=29), generated with kicad-footprint-generator.

3.43619 3.13874 21.7467 facet normal 5.212130e-13 -1.000000e+00.
-0.0981585 0 vertex -7.20568.
2.537094e-001 -4.349532e-001 8.639718e-001 facet normal -4.648473e-001 -8.134815e-001 3.495210e-001.
-3.16429 -1.31069 6.59 facet normal 0.586527.

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