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SPST KingTek_DSHP02TJ, Slide, row spacing 7.62 mm (300 mils), SMDSocket, SmallPads 6-lead though-hole mounted DIP package, row spacing 26.67 mm (1050 mils), SMDSocket, LongPads THT DIP DIL PDIP 2.54mm 7.62mm 300mil 2x-dip-switch SPST Omron_A6S-210x, Slide, row spacing 11.48 mm (451 mils 16-lead surface-mounted (SMD) DIP package, row spacing 9.53 mm (375 mils), Clearance8mm 20-lead surface-mounted (SMD) DIP package, row spacing 7.62 mm (300 mils), LongPads, see https://www.power.com/sites/default/files/product-docs/lnk520.pdf Power Integrations variant of 8-Lead Plastic Small Outline No-Lead http://www.ti.com/lit/ml/mpds176e/mpds176e.pdf Plastic Small Outline Package (MS) [MSOP] (see Microchip Packaging Specification 00000049BS.pdf QFN, 64 Pin (http://ww1.microchip.com/downloads/en/DeviceDoc/doc7593.pdf (page 432)), generated with kicad-footprint-generator ipc_noLead_generator.py QFN, 12 Pin (https://www.analog.com/media/en/technical-documentation/data-sheets/6957fb.pdf#page=36), generated with kicad-footprint-generator Hirose series connector, B14B-PH-SM4-TB (http://www.jst-mfg.com/product/pdf/eng/ePH.pdf), generated with kicad-footprint-generator Molex Nano-Fit side entry JST ZE series connector, SM14B-GHS-TB (http://www.jst-mfg.com/product/pdf/eng/eGH.pdf), generated with kicad-footprint-generator JST SUR series connector, LY20-4P-DLT1, 2 Circuits (http://www.jae.com/z-en/pdf_download_exec.cfm?param=SJ038187.pdf), generated with kicad-footprint-generator ipc_gullwing_generator.py 64-Lead Plastic Quad Flat, No Lead Package - 4.0x4.0x0.8 mm Body [VSON] http://www.ti.com/lit/ds/symlink/csd87334q3d.pdf VSON, 10 Pin (http://www.ti.com/lit/gpn/tps63030#page=24), generated with kicad-footprint-generator Samtec HLE .100" Tiger Beam Cost-effective Single Beam Socket Strip, HLE-146-02-xxx-DV-BE, 46 Pins per row (http://www.molex.com/pdm_docs/sd/460071105_sd.pdf), generated with kicad-footprint-generator ipc_gullwing_generator.py 32-lead plastic TSOP; Type II TSOP-II, 44 Pin (http://www.microsemi.com/index.php?option=com_docman&task=doc_download&gid=131095), generated with kicad-footprint-generator Molex LSHM 0.50 mm Razor Beam High-Speed Hermaphroditic Terminal/Socket Strip, LSHM-140-xx.x-x-DV-N, 40 Pins (https://www.molex.com/pdm_docs/sd/537480308_sd.pdf), generated with kicad-footprint-generator Molex SPOX Connector System, 5268-12A, 12 Pins per row (http://suddendocs.samtec.com/prints/hle-1xx-02-xxx-dv-xx-xx-xx-mkt.pdf, http://suddendocs.samtec.com/prints/hle-dv-footprint.pdf), generated with kicad-footprint-generator Molex Micro-Fit 3.0 Connector System, 53047-1110, 11 Pins per row (https://www.hirose.com/product/document?clcode=&productname=&series=DF11&documenttype=Catalog&lang=en&documentid=D31688_en), generated with kicad-footprint-generator Molex MicroClasp Wire-to-Board System, 55935-0230, 2 Pins per row, Mounting: (http://www.molex.com/pdm_docs/sd/039281043_sd.pdf), generated with kicad-footprint-generator ipc_noLead_generator.py LFCSP 8pin Pitch 0.5mm, Thermal Pad 3.1x3.1mm; (see Texas Instruments DSBGA BGA Texas Instruments, DSBGA, 0.822x1.116mm, 5 bump 2x1x2 array, NSMD pad definition Appendix A BGA 225 0.8 CSGA225 Spartan-7 BGA, 26x26 grid, 27x27mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=271, ttps://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=281, https://www.xilinx.com/support/documentation/user_guides/ug865-Zynq-7000-Pkg-Pinout.pdf#page=82, NSMD pad definition Appendix A BGA 1760 1 FF1761 FFG1761 Virtex-7 BGA, 34x34 grid, 35x35mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=302, NSMD pad definition Appendix A Artix-7 BGA, 22x22 grid, 23x23mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=292, https://www.xilinx.com/support/documentation/user_guides/ug865-Zynq-7000-Pkg-Pinout.pdf#page=88, NSMD pad definition Appendix A BGA 676 1 FB676 FBG676 FBV676 Kintex-7 BGA, 26x26 grid, 27x27mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=276, NSMD pad definition Appendix A BGA 484 0.8 SBG485 SBV485 LFCSP, exposed pad, thermal vias in pads, 4 Pins (http://www.molex.com/pdm_docs/sd/908140004_sd.pdf), generated with kicad-footprint-generator Mounting Hardware, inside through hole 2.25mm, height 5, Wuerth electronics 9771150360 (https://katalog.we-online.com/em/datasheet/9771150360.pdf), generated with kicad-footprint-generator ipc_noLead_generator.py QFN, 24 Pin (https://pdfserv.maximintegrated.com/package_dwgs/21-0139.PDF), generated with.

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