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Back{KiCad 5.1.10-88a1d61d58~90~ubuntu20.04.1} date Thu Aug 12 11:11:04 2021 ; DRILL file {KiCad 5.1.10-88a1d61d58~90~ubuntu20.04.1} date Sat Aug 7 13:40:31 2021 ; DRILL file {KiCad 7.0.11-7.0.11~ubuntu22.04.1} date Tue Mar 5 20:19:51 2024 Copper Layer Stackup: ============================================================= L1 : F.Cu front L2 : B.Cu back Drill file 'precadsr-panel.drl' contains plated through holes are merged with plated holes Total unplated holes count 16 Latest commits for file Datasheets/2N3903-Motorola.pdf # Autorouter files (exported from Pcbnew *.ses # Exported BOM files *.xml *.csv # KiCad backups folders *-backups # Compressed files *.zip # Mac stuff *.DS_Store # Emacs temps *~ \#* # LTSpice Simulations/*.log Simulations/*.raw Simulations/*.txt Copper Layer.
- 15.8x17.7x2mm, https://www.quectel.com/UploadImage/Downlad/Quectel_BC66_Hardware_Design_V1.1.pdf GSM NB-IoT module BC95 Quad-Band.
- Vertex -5.09939 6.16411 20 facet.
- Vertex -9.049876e+01 1.005513e+02 1.168708e+01 facet normal 4.928424e-001 -8.701186e-001.
- -7.13321 6.87796 facet normal -0.618852.
- -0.865125 0.246476 vertex -6.7445 -0.892525.