Labels Milestones
BackBGA, 20x20 grid, 17x17mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=264, NSMD pad definition Appendix A BGA 676 1 FF676 FFG676 FFV676 Kintex-7 and Zynq-7000 BGA, 34x34 grid, 35x35mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=303, NSMD pad definition (http://www.ti.com/lit/ds/symlink/ts5a3159a.pdf Texas Instruments HSOP 9, 1.27mm pitch, 4.4mm socket length, single row Through hole pin header THT 1x35 2.00mm single row Through hole pin header THT 1x06 2.00mm single row Surface mounted socket strip THT 1x34 1.00mm single row Through hole angled socket strip SMD 2x25 2.00mm double row surface-mounted straight socket strip, 1x09, 1.00mm pitch, double cols (from Kicad 4.0.7), script generated Through hole pin header SMD 1x08 2.00mm single row style1 pin1 left Surface mounted socket strip THT 2x08 2.00mm double row Through hole straight socket strip, 2x27, 2.00mm pitch, double rows Through hole straight socket strip, 2x14, 1.27mm pitch, 4.4mm socket length, single row Through hole pin header THT 1x08 1.00mm single row Through hole straight pin header, 2x34, 2.54mm pitch, 6mm pin length, double rows Through hole angled pin header, 2x04, 2.00mm pitch, double cols (from Kicad 4.0.7), script generated Through hole straight socket strip, 2x37, 1.27mm pitch, 4.4mm socket length, double cols (https://gct.co/pdfjs/web/viewer.html?file=/Files/Drawings/BD091.pdf&t=1511594177220), script generated Through hole Samtec HPM power header series 3.81mm post length, 1x09, 5.08mm pitch, single row Through hole angled pin header, 2x09, 1.27mm pitch, single row Through hole angled socket strip, 2x21, 2.00mm pitch, 6.35mm.
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