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Number: 26-60-5060, 6 Pins per row (http://www.molex.com/pdm_docs/sd/431602102_sd.pdf), generated with kicad-footprint-generator ipc_noLead_generator.py DFN, 8 Pin (http://www.winbond.com/resource-files/w25q32jv%20revg%2003272018%20plus.pdf (page 68)), generated with kicad-footprint-generator Molex Nano-Fit Power Connectors, old mpn/engineering number: 5569-16A1, example for new part number: 26-60-5180, 18 Pins per row (https://www.hirose.com/product/en/products/FH12/FH12-24S-0.5SH(55)/), generated with kicad-footprint-generator Molex KK 396 Interconnect System, old/engineering part number: 09-65-2108, 10 Pins per row (http://suddendocs.samtec.com/prints/hle-1xx-02-xxx-dv-xx-xx-xx-mkt.pdf, http://suddendocs.samtec.com/prints/hle-dv-footprint.pdf), generated with kicad-footprint-generator JST XA series connector, DF3EA-08P-2H (https://www.hirose.com/product/document?clcode=CL0543-0332-0-51&productname=DF3EA-5P-2H(51)&series=DF3&documenttype=2DDrawing⟨=en&documentid=0001163317), generated with kicad-footprint-generator Soldered wire connection, for 4 times 2 mm² wires, reinforced insulation, conductor diameter 0.65mm, outer diameter 1.7mm, outer diameter 2.3mm, see http://www.metz-connect.com/de/system/files/productfiles/Datenblatt_310591_RT063xxHBWC_OFF-022684T.pdf, script-generated using https://github.com/pointhi/kicad-footprint-generator/scripts/TerminalBlock_RND THT terminal block RND 205-00078, vertical (cable from top), 14 pins, pitch 2.54mm, package size 11.5x8.5x17.5mm^3, https://www.recom-power.com/pdf/Innoline/R-78HBxx-0.5_L.pdf DCDC-Converter, RECOM, RECOM_R-78HB-0.5, SIP-3, pitch 2.54mm, size 25.86x6.5mm^2, drill diamater 1.3mm, pad diameter 2.5mm, see http://cdn-reichelt.de/documents/datenblatt/C151/RND_205-00067_DB_EN.pdf, script-generated using https://github.com/pointhi/kicad-footprint-generator/scripts/TerminalBlock_MetzConnect THT terminal block Metz Connect Type701_RT11L03HGLU, 3 pins, pitch 5mm, size 40x10mm^2, drill diamater 1.3mm, pad diameter 2.4mm, see http://www.4uconnector.com/online/object/4udrawing/20223.pdf, script-generated using https://github.com/pointhi/kicad-footprint-generator/scripts/TerminalBlock_RND THT terminal block Metz Connect Type086_RT03405HBLC, 5 pins, pitch 2.54mm, package size 62x19.5x14mm, https://silvertel.com/images/datasheets/Ag5400-datasheet-high%20Efficiency-30W-Power-Over-Ethernet-Plus-Module-PoE+PD.pdf DCDC-Converter Silvertel Ag5810 single output POE DCDC-Converter TRACO TMR1-xxxx Dual_output DCDC-Converter, TRACO, TMR 1-xxxx, Dual output, http://www.cincon.com/upload/media/data%20sheets/Data%20Sheet%20(DC)/B%20CASE/SPEC-EC5BE-V24.pdf DCDC-Converter CINCON EC5BExx 18-36VDC to dual output, SIP package style, https://power.murata.com/data/power/ncl/kdc_mej1.pdf Abracon Miniature Ceramic Smd Crystal ABM3 http://www.abracon.com/Resonators/abm3.pdf, 5.0x3.2mm^2 package Miniature Crystal Clock Oscillator TG2520 series, https://support.epson.biz/td/api/doc_check.php?dl=app_TG2520SMN⟨=en Miniature Crystal Clock Oscillator TXCO Fordahl DFA S15-OV/UOV, http://www.iqdfrequencyproducts.com/products/details/iqxo-70-11-30.pdf, 5.0x3.2mm^2 package Abracon Miniature Ceramic Smd Crystal ABM3 http://www.abracon.com/Resonators/abm3.pdf, 5.0x3.2mm^2 package 14-lead dip package, row spacing 8.61 mm (338 mils), body size 6.7x26.96mm (see e.g. Https://www.ctscorp.com/wp-content/uploads/209-210.pdf), LowProfile 8x-dip-switch SPST KingTek_DSHP08TJ, Slide, row spacing 8.9 mm (350 mils), body size (see https://www.omron.com/ecb/products/pdf/en-a6h.pdf SMD 8x-dip-switch SPST KingTek_DSHP08TJ, Slide, row spacing 7.62 mm (300 mils), body size 9.78x25.04mm (see e.g. Https://www.ctscorp.com/wp-content/uploads/206-208.pdf 8x-dip-switch SPST , Piano, row spacing 11.48 mm (451 mils 24-lead though-hole mounted DIP package, row spacing 25.24 mm (993 mils SMD DIP DIL PDIP SMDIP 2.54mm 7.62mm 300mil 1x-dip-switch SPST Copal_CHS-01A, Slide, row spacing 7.62 mm (300 mils 20-lead though-hole mounted DIP package, row spacing 15.24 mm (600 mils), Socket, LongPads 22-lead though-hole mounted DIP package, row spacing 10.16 mm (400 mils), Socket, LongPads 18-lead though-hole mounted DIP package, row spacing 10.16 mm (400 mils 8-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), SMDSocket, SmallPads 16-lead though-hole mounted DIP package, row spacing 5.9 mm (232 mils), body size 6.7x11.72mm (see e.g. Https://www.ctscorp.com/wp-content/uploads/204.pdf), SMD SMD 2x-dip-switch SPST , Slide.

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