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Back2.2mm) (see https://www.onsemi.com/pdf/datasheet/emi8132-d.pdf Thermally-enhanced SO-8 PowerPAK PQFN Q5A PowerFLAT LFPAK SOT669 WPAK(3F) LFPAK Power56 PMPAK PowerDFN56 HSOP8 PRPAK56 PDFN HVSON QFN, 24 Pin (http://www.thatcorp.com/datashts/THAT_5173_Datasheet.pdf#page=17), generated with kicad-footprint-generator Molex KK 396 Interconnect System, old/engineering part number: AE-6410-09A example for new part number: 5273-09A example for new mpn: 39-28-x08x, 4 Pins (http://www.molex.com/pdm_docs/sd/559350210_sd.pdf), generated with kicad-footprint-generator Molex JAE 0.2mm pitch, 1mm overall height FFC/FPC connector, 10 bottom-side contacts, 1.0mm pitch, 1.0mm height, SMT, http://www.te.com/commerce/DocumentDelivery/DDEController?Action=srchrtrv&DocNm=84952&DocType=Customer+Drawing&DocLang=English&DocFormat=pdf&PartCntxt=84952-4 TE FPC connector, 11 top-side contacts, 1.0mm pitch, 1.0mm height, SMT, http://www.te.com/commerce/DocumentDelivery/DDEController?Action=srchrtrv&DocNm=84952&DocType=Customer+Drawing&DocLang=English&DocFormat=pdf&PartCntxt=84952-4 TE FPC connector, 28 top-side contacts, 1.0mm pitch, 1.0mm height, SMT.
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