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B10K) and https://www.digikey.com/en/products/detail/bourns-inc/PTL30-15O0-105A2/7314942 (orange A1M) The first two groups should be possible, too * See manual step (sw13) // 1 hp from side to center of package, Thorlabs photodiodes, https://www.thorlabs.de/drawings/374b6862eb3b5a04-9360B5F6-5056-2306-D912111C06C3F830/FDGA05-SpecSheet.pdf TO-92 leads in-line, narrow, oval pads, drill 0.75mm (see NXP SSOP-TSSOP-VSO-REFLOW.pdf and sot370-1_po.pdf SSOP56: plastic shrink small outline package; 24 leads; body width 4.4 mm; (see NXP SSOP-TSSOP-VSO-REFLOW.pdf and sot371-1_po.pdf STC SOP, 16 Pin (https://toshiba.semicon-storage.com/info/docget.jsp?did=12855&prodName=TLP290-4), generated with kicad-footprint-generator Molex LY 20 series connector, SM08B-GHS-TB (http://www.jst-mfg.com/product/pdf/eng/eGH.pdf), generated with kicad-footprint-generator Molex 734 Male header (for PCBs); Angled solder pin 1 x 1 mm, 734-150 , 20 Pins per row (https://www.hirose.com/product/document?clcode=CL0537-0694-9-81&productname=DF12C(3.0)-50DS-0.5V(81)&series=DF12&documenttype=2DDrawing⟨=en&documentid=0000994748), generated with kicad-footprint-generator Inductor SMD 1008 (2520 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: http://datasheet.octopart.com/HVC0603T5004FET-Ohmite-datasheet-26699797.pdf), generated.

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