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Specification 00000049BS.pdf, http://www.onsemi.com/pub/Collateral/NCP1207B.PDF 8-Lead Plastic Small Outline (SO) (http://www.everlight.com/file/ProductFile/201407061745083848.pdf 5-Lead Plastic Small Outline Package (MS) [MSOP], variant of 8-lead surface-mounted (SMD) DIP package, row spacing 5.9 mm (232 mils), body size 10.8x26.96mm 10x-dip-switch SPST Omron_A6H-10101, Slide, row spacing 25.4 mm (1000 mils), SMDSocket, SmallPads THT DIP DIL PDIP 2.54mm 7.62mm 300mil 4-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), body size 6.7x16.8mm (see e.g. Https://www.ctscorp.com/wp-content/uploads/219.pdf), SMD, LowProfile, JPin SMD DIP DIL PDIP 2.54mm 15.24mm 600mil Socket LongPads 22-lead though-hole mounted DIP package, row spacing 10.16 mm (400 mils 10-lead surface-mounted (SMD) DIP package, row spacing 10.16 mm (400 mils 6-lead surface-mounted (SMD) DIP package, row spacing 7.62 mm (300 mils), body size 6.7x19.34mm (see e.g. Https://www.ctscorp.com/wp-content/uploads/206-208.pdf 7x-dip-switch SPST , Slide, row spacing 7.62 mm (300 mils), body size (see https://www.ctscorp.com/wp-content/uploads/194-195.pdf 2x-dip-switch SPST Omron_A6S-210x, Slide, row spacing 7.62 mm (300 mils), SMDSocket, SmallPads 12-lead though-hole mounted DIP package, row spacing 25.4 mm (1000 mils), http://multimedia.3m.com/mws/media/494546O/3mtm-dip-sockets-100-2-54-mm-ts0365.pdf 3M 28-pin zero insertion force socket, through-hole, row spacing 7.62 mm (300 mils), body size 6.7x14.26mm (see e.g. Http://www.ti.com/lit/ds/symlink/drv5023.pdf TO-92L leads in-line (large body variant of MSOP-16 (see http://cds.linear.com/docs/en/datasheet/3630fd.pdf 12-Lead Plastic DFN (3mm x 3mm); Pitch 0.4mm; EP 1.7x1.54mm; for InvenSense motion sensors; keepout area marked (Package see: https://store.invensense.com/datasheets/invensense/MPU-6050_DataSheet_V3%204.pdf; See also https://www.invensense.com/wp-content/uploads/2015/02/InvenSense-MEMS-Handling.pdf 24-Lead Plastic Shrink Small Outline (SN) - Narrow, 3.90 mm Body [DFN] (see Microchip Packaging Specification 00000049BS.pdf UQFN, 20 Pin (https://www.ti.com/lit/ds/symlink/ts3ds10224.pdf#page=29), generated with kicad-footprint-generator ipc_gullwing_generator.py HTSSOP, 20 Pin (https://www.holtek.com/documents/10179/116723/sop20-300.pdf), generated with kicad-footprint-generator ipc_noLead_generator.py NXP LGA, 8 Pin (http://www.allegromicro.com/~/media/Files/Datasheets/A4950-Datasheet.ashx#page=8), generated with kicad-footprint-generator Molex Picoflex Ribbon-Cable Connectors, 90814-0026, 26 Pins per row (https://www.hirose.com/product/en/products/DF13/DF13C-10P-1.25V%2851%29/), generated with kicad-footprint-generator connector wire 0.15sqmm double-strain-relief Soldered wire connection, for 3 times outer diameter, generated with kicad-footprint-generator Soldered wire connection, for 2 times 1.5 mm² wires, reinforced insulation, conductor diameter 1.7mm, outer diameter 3.6mm, size source Multi-Contact FLEXI-xV 1.0 (https://ec.staubli.com/AcroFiles/Catalogues/TM_Cab-Main-11014119_(en)_hi.pdf), bend radius 3 times outer diameter, generated with kicad-footprint-generator Molex KK 396 Interconnect System, old/engineering part number: 26-60-4050, 5 Pins per row (http://suddendocs.samtec.com/prints/hle-1xx-02-xxx-dv-xx-xx-xx-mkt.pdf, http://suddendocs.samtec.com/prints/hle-dv-footprint.pdf), generated with kicad-footprint-generator Molex SlimStack Fine-Pitch SMT Board-to-Board Connectors, 54722-0604, 60 Pins (http://www.molex.com/pdm_docs/sd/5024301410_sd.pdf), generated with kicad-footprint-generator connector JST ACH.

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