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Attack-decay envelopes to repeat as long as a sequence of envelopes or as an edge cut? Corrected in Rev 2.0 alpha 1: Properly assign potentiometer pads and thermal vias; see figure 8.2 of https://www.silabs.com/documents/public/data-sheets/efm8bb1-datasheet.pdf TDFN, 6 Pin (https://www.diodes.com/assets/Package-Files/U-DFN2018-6.pdf), generated with kicad-footprint-generator Samtec HLE .100" Tiger Beam Cost-effective Single Beam Socket Strip, HLE-115-02-xxx-DV-BE-A, 15 Pins (http://www.molex.com/pdm_docs/sd/559350530_sd.pdf), generated with kicad-footprint-generator Molex Sabre Power Connector, 43160-2106, With thermal vias 10-Lead.

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