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Body width 3 mm; (see NXP SSOP-TSSOP-VSO-REFLOW.pdf and sot370-1_po.pdf SSOP56: plastic shrink small outline package; 16 leads; body width 4.4 mm; (see NXP SSOP-TSSOP-VSO-REFLOW.pdf and sot505-1_po.pdf TSSOP, 8 Pin (http://ww1.microchip.com/downloads/en/DeviceDoc/Atmel-8127-AVR-8-bit-Microcontroller-ATtiny4-ATtiny5-ATtiny9-ATtiny10_Datasheet.pdf), generated with kicad-footprint-generator Capacitor SMD 2225 (5664 Metric), square (rectangular) end terminal, IPC_7351 nominal, (Body size source: IPC-SM-782 page 76, https://www.pcb-3d.com/wordpress/wp-content/uploads/ipc-sm-782a_amendment_1_and_2.pdf), generated with kicad-footprint-generator Mounting Hardware, inside through hole ST Morpho Connector 144 STLink AI accelerated MCU with optional wifi, https://dl.sipeed.com/MAIX/HDK/Sipeed-M1&M1W/Specifications AI Kendryte K210 RISC-V Texas Instruments HSOP 9, 1.27mm pitch, 4.4mm socket length, single row Surface mounted pin header THT 2x15 2.00mm double row Through hole straight socket strip, 2x15, 2.54mm pitch, 8.51mm socket length, single row (from Kicad 4.0.7), script generated Through hole straight pin header, 1x11, 1.27mm pitch, double cols (from Kicad 4.0.7), script generated Through hole pin header SMD 2x39 1.27mm double row Through hole straight socket strip, 1x04, 2.54mm pitch, double rows Through hole angled pin header, 1x13, 1.00mm pitch, double rows Surface mounted socket strip THT.

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