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(http://www.ti.com/lit/ds/symlink/lm5175.pdf#page=40), generated with kicad-footprint-generator Mounting Hardware, inside through hole M3, height 3.6, Wuerth electronics 9776050960 (https://katalog.we-online.com/em/datasheet/9776050960.pdf), generated with kicad-footprint-generator Mounting Hardware, inside through hole M3, height 6, Wuerth electronics 9774030243 (https://katalog.we-online.de/em/datasheet/9774030243.pdf), generated with kicad-footprint-generator ipc_noLead_generator.py QFN, 20 Pin (https://resurgentsemi.com/wp-content/uploads/2018/09/MPR121_rev5-Resurgent.pdf?d453f8&d453f8), generated with kicad-footprint-generator ipc_gullwing_generator.py MSOP, 16 Pin (http://www.ti.com/lit/ds/sbos354a/sbos354a.pdf, JEDEC MO-220 variation VGGC), generated with kicad-footprint-generator JST XA series connector, B8P-VH-FB-B, shrouded (http://www.jst-mfg.com/product/pdf/eng/eVH.pdf), generated with kicad-footprint-generator ipc_gullwing_generator.py MultiPowerSO-30 3EP 16.0x17.2mm Pitch 1mm ST PowerSSO-24 1EP 7.5x10.3mm Pitch 0.8mm ST PowerSSO-36 1EP 7.5x10.3mm Pitch 0.8mm 8-Lead Plastic Dual Flat No-Lead Package, 9x9mm Body (see Microchip Packaging Specification 00000049BS.pdf 8-Lead Plastic Stretched Small Outline (SSO/Stretched SO), see https://www.vishay.com/docs/83831/lh1533ab.pdf SSO Stretched SO SOIC 2.54 8-Lead Plastic Small Outline Package (MS) [MSOP], variant of 8-lead surface-mounted (SMD) DIP package, row spacing 10.16 mm (400 mils 12-lead surface-mounted (SMD) DIP package, row spacing 8.9 mm (350 mils), SMDSocket, SmallPads 16-lead though-hole mounted DIP package, row spacing 15.24 mm (600 mils), SMDSocket, LongPads 22-lead though-hole mounted DIP package, row spacing 5.9 mm (232 mils), body size (see https://www.omron.com/ecb/products/pdf/en-a6h.pdf.

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