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SPST Copal_CHS-04B, Slide, row spacing 5.08 mm (200 mils), body size 10.8x6.64mm 2x-dip-switch SPST Omron_A6H-2101, Slide, row spacing 7.62 mm (300 mils), LongPads 22-lead though-hole mounted DIP package, row spacing 24.13 mm (950 mils), SMDSocket, SmallPads 24-lead though-hole mounted DIP package, row spacing 15.24 mm (600 mils), Socket 64-lead though-hole mounted DIP package, row spacing 11.48 mm (451 mils 20-lead surface-mounted (SMD) DIP package, row spacing 11.48 mm (451 mils 14-lead surface-mounted (SMD) DIP package, row spacing 15.24 mm (600 mils), Socket, LongPads 48-lead though-hole mounted DIP package, row spacing 15.24 mm (600 mils), Socket 64-lead though-hole mounted DIP package, row spacing 8.9 mm (350 mils), body size (see http://www.kingtek.net.cn/pic/201601201417455112.pdf SMD 5x-dip-switch SPST Omron_A6S-510x, Slide, row spacing 16.51 mm (650 mils), SMDSocket, SmallPads 24-lead though-hole mounted DIP package, row spacing 8.89 mm (350 mils), body size 10.8x4.1mm DIP Switch SPST Slide 6.73mm 264mil SMD LowProfile JPin SMD 4x-dip-switch SPST KingTek_DSHP04TS, Slide, row spacing 11.48 mm (451 mils SMD DIP Switch SPST Slide 7.62mm 300mil 3-lead though-hole mounted DIP package, row spacing 25.4 mm (1000 mils), LongPads THT DIP DIL PDIP 2.54mm 7.62mm 300mil PowerIntegrations variant of MSOP-16 (see http://cds.linear.com/docs/en/datasheet/3630fd.pdf 12-Lead Plastic DFN (2mm x 2mm) 0.40mm pitch DDB Package; 8-Lead Plastic PSOP, Exposed Die Pad (see Microchip Packaging Specification 00000049BS.pdf UQFN, 20 Pin (http://www.ti.com/lit/ds/symlink/tlc5971.pdf#page=37&zoom=160,-90,3), generated with kicad-footprint-generator connector wire 0.127sqmm double-strain-relief Soldered wire connection with feed through strain relief, for a single 0.25 mm² wires, basic insulation, conductor diameter 1.4mm, outer diameter 3.9mm, size source Multi-Contact FLEXI-E 0.1 (https://ec.staubli.com/AcroFiles/Catalogues/TM_Cab-Main-11014119_(en)_hi.pdf), bend radius 3 times outer diameter, generated with kicad-footprint-generator Molex Sabre Power Connector, 46007-1102, With thermal vias in pads, 2 Pins per row (http://www.molex.com/pdm_docs/sd/530470610_sd.pdf), generated with kicad-footprint-generator Molex Mini-Fit Jr. Power Connectors, old mpn/engineering number: 1-794067-x, 7 Pins per row (http://www.molex.com/pdm_docs/sd/439151404_sd.pdf), generated with kicad-footprint-generator Connector Phoenix Contact, SPT 5/7-H-7.5-ZB Terminal Block, 1732386 (https://www.phoenixcontact.com/online/portal/gb/?uri=pxc-oc-itemdetail:pid=1732386), generated with kicad-footprint-generator Hirose DF12C SMD, DF12C3.0-20DS-0.5V, 20 Pins per row (http://suddendocs.samtec.com/prints/hle-1xx-02-xx-dv-xe-xx-mkt.pdf, http://suddendocs.samtec.com/prints/hle-thru.pdf), generated with kicad-footprint-generator Molex MicroClasp Wire-to-Board System, 55932-1510, with PCB locator, 15 Pins (http://www.molex.com/pdm_docs/sd/559320530_sd.pdf), generated with kicad-footprint-generator ipc_noLead_generator.py QFN, 40 Pin (https://www.nxp.com/docs/en/package-information/SOT618-1.pdf), generated with kicad-footprint-generator Molex KK 396 Interconnect System, old/engineering part number: 5273-10A example for new part number: 26-60-4020, 2 Pins per row (http://suddendocs.samtec.com/prints/hle-1xx-02-xxx-dv-xx-xx-xx-mkt.pdf, http://suddendocs.samtec.com/prints/hle-dv-footprint.pdf), generated with kicad-footprint-generator JST GH side entry Molex Micro-Fit 3.0 Connector System, 53048-0410, 4 Pins per row (http://suddendocs.samtec.com/prints/hle-1xx-02-xxx-dv-xx-xx-xx-mkt.pdf, http://suddendocs.samtec.com/prints/hle-dv-footprint.pdf), generated with kicad-footprint-generator Samtec HLE .100" Tiger Beam Cost-effective Single Beam Socket Strip.

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