Labels Milestones
Back2x3 (perimeter) array, NSMD pad definition (http://www.ti.com/lit/ds/symlink/tlv320aic23b.pdf, http://www.ti.com/lit/wp/ssyz015b/ssyz015b.pdf Texas Instruments, DSBGA-6, 0.704x1.054mm, NSMD, YKA pad definition, 1.468x0.705mm, 8 Ball, 2x4 Layout, 0.5mm Pitch, http://www.ti.com/lit/ds/symlink/ts3a24159.pdf Texas Instruments, DSBGA, 1.36x1.86mm, 12 bump 3x4 (area) array, NSMD pad definition (http://www.ti.com/lit/ds/symlink/lm4990.pdf, http://www.ti.com/lit/an/snva009ag/snva009ag.pdf Texas Instruments HSOP 9, 1.27mm pitch, double rows Through hole horizontal IDC box header 2x20 2.54mm double row Through hole pin header THT 1x04 1.00mm single row style1 pin1 left Surface mounted pin header SMD 2x29 2.54mm double row Through hole straight pin header, 2x25, 2.54mm pitch, DIN 41651 / IEC 60603-13, double rows, https://www.tme.eu/Document/4baa0e952ce73e37bc68cf730b541507/T821M114A1S100CEU-B.pdf SMD vertical IDC box header THT 1x26 1.27mm single row Through hole straight socket strip, 1x09, 2.54mm pitch, 6mm pin length, single row (from Kicad 4.0.7), script generated Through hole angled pin header THT 2x09 2.54mm double row Through hole straight socket strip, 2x33.
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