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Clearance8mm 10-lead surface-mounted (SMD) DIP package, row spacing 7.62 mm (300 mils 14-lead surface-mounted (SMD) DIP package, row spacing 9.53 mm (375 mils 10-lead surface-mounted (SMD) DIP package, row spacing 15.24 mm (600 mils), LongPads 10-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), SMDSocket, SmallPads 64-lead though-hole mounted DIP package, row spacing 25.4 mm (1000 mils), Socket 42-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils 28-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), see http://cdn-reichelt.de/documents/datenblatt/A400/HDBL101G_20SERIES-TSC.pdf DIL DIP PDIP 5.08mm 7.62mm 300mil PowerIntegrations variant of 8-lead surface-mounted (SMD) DIP package, row spacing 7.62 mm (300 mils), SMDSocket, SmallPads 14-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), Socket THT DIP DIL PDIP 2.54mm 7.62mm 300mil Vishay HVMDIP HEXDIP DirectFET L4 MOSFET Infineon DirectFET MU MOSFET Infineon DirectFET LA MOSFET Infineon DirectFET MX MOSFET Infineon DirectFET SJ MOSFET Infineon DirectFET MF MOSFET Infineon DirectFET MQ MOSFET Infineon DirectFET MF MOSFET Infineon DirectFET MZ MOSFET Infineon DirectFET SQ MOSFET Infineon DirectFET SA MOSFET Infineon DirectFET S2 MOSFET Infineon DirectFET ME MOSFET Infineon DirectFET MA MOSFET Infineon DirectFET LA MOSFET Infineon DirectFET S3C MOSFET Infineon DirectFET MT MOSFET Infineon DirectFET MN MOSFET Infineon DirectFET SC MOSFET Infineon DirectFET MQ MOSFET Infineon DirectFET S1 MOSFET Infineon DirectFET S2 MOSFET Infineon DirectFET M2 MOSFET Infineon DirectFET MD MOSFET Infineon DirectFET ME MOSFET Infineon DirectFET MZ MOSFET Infineon DirectFET.

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