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Pad, 4x4mm body, pitch 0.5mm, thermal vias in pads, 6 Pins (http://www.farnell.com/datasheets/2157639.pdf), generated with kicad-footprint-generator ipc_noLead_generator.py TQFN, 40 Pin (https://www.jedec.org/standards-documents/docs/mo-142-d variation EC), generated with kicad-footprint-generator Soldered wire connection with double feed through strain relief, for a box film cap instead of A4 71248cb440f4d8f8daaed2a21ef26b099a9d8e65 Add note resulting from real TL0x4s d12ec1f19bbae8f01395e4c76a152d3d4ce7a3d4 created pull request synth_mages/MK_VCO#3 created pull request 'new_footprints' (#5) from new_footprints into main Merge pull request synth_mages/MK_VCO#5 613d1b6f7e Merge pull request 'Put title box in PDF export 45cf8c00cd Merge pull.

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