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Power-Integrations variant of 8-lead surface-mounted (SMD) DIP package, row spacing 8.9 mm (350 mils), SMDSocket, SmallPads 24-lead though-hole mounted DIP package, row spacing 9.53 mm (375 mils 24-lead surface-mounted (SMD) DIP package, row spacing.

• Http://www.ti.com/lit/ds/symlink/tpd4e02b04.pdf USON-10 2.5x1.0mm Pitch 0.5mm.
• Connector, B7B-XH-A (http://www.jst-mfg.com/product/pdf/eng/eXH.pdf), generated with kicad-footprint-generator.
• 0.796857 -0.241727 0.553703 facet normal -0.956942.
• -0.0624768 0.995139 vertex -7.64388 -1.52046 5.97318 vertex 1.56356.

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