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BackHttps://assets.nexperia.com/documents/package-information/SOT763-1.pdf), generated with kicad-footprint-generator Molex KK-254 Interconnect System, old/engineering part number: 26-60-5160, 16 Pins (https://www.te.com/commerce/DocumentDelivery/DDEController?Action=srchrtrv&DocNm=826576&DocType=Customer+Drawing&DocLang=English), generated with kicad-footprint-generator connector JST J2100 series connector, 502382-0870 (http://www.molex.com/pdm_docs/sd/5023820270_sd.pdf), generated with kicad-footprint-generator Harwin Male Horizontal Surface Mount Tactile Switch SPST Slide 7.62mm 300mil reed relay Standex-Meder SIL-relais, Form 1A, see https://standexelectronics.com/wp-content/uploads/datasheet_reed_relay_SIL.pdf Miniature PCB Relay, PCH Series, 1 Form A http://image.schrack.com/datenblaetter/h_rp810012-b.pdf Relay SPST Schrack-RP-II/1 RM3.5mm 8A 250V AC Form C http://image.schrack.com/datenblaetter/h_rt114012--_de.pdf Relay SPST Schrack-RP-II/1 RM5mm 16A 250V AC Form C http://www.te.com/commerce/DocumentDelivery/DDEController?Action=srchrtrv&DocNm=RT2_reflow&DocType=DS&DocLang=EN Relay SPST High Capacity Relay, SPST-NO Form A, vertical mount, 6A, 5-60V, https://www.fujitsu.com/sg/imagesgig5/ftr-ly.pdf relay SPST-NO form A vertical Omron Relay, SPST, https://omronfs.omron.com/en_US/ecb/products/pdf/en-g2rl.pdf Omron G5V-2 Relay DPDT Finder 96.12 56.32 package for diode bridges, row spacing 8.89 mm (350 mils), SMDSocket, SmallPads 28-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), body size 9.78x25.04mm (see e.g. Https://www.ctscorp.com/wp-content/uploads/209-210.pdf), LowProfile 3x-dip-switch SPST , Slide, row spacing 7.62 mm (300 mils), Socket 10-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), SMDSocket, LongPads 64-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), body size (see https://www.ctscorp.com/wp-content/uploads/194-195.pdf 4x-dip-switch SPST KingTek_DSHP04TJ, Slide, row spacing 7.62 mm (300 mils), LongPads 6-lead though-hole mounted DIP package, row spacing 15.24 mm (600 mils 40-lead surface-mounted (SMD) DIP package, row spacing 7.62 mm (300 mils), LongPads 48-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), LongPads 22-lead though-hole mounted DIP package, row spacing 26.67 mm (1050 mils), SMDSocket, SmallPads 48-lead though-hole mounted DIP package, row spacing 10.16 mm (400 mils), LongPads THT DIP DIL PDIP 2.54mm 7.62mm 300mil Vishay HVMDIP HEXDIP DirectFET L4 MOSFET Infineon DirectFET M2 MOSFET Infineon DirectFET MZ MOSFET Infineon DirectFET MC MOSFET Infineon DirectFET MX MOSFET Infineon DirectFET MP MOSFET Infineon DirectFET ST MOSFET Infineon DirectFET MB MOSFET Infineon DirectFET L8 MOSFET Infineon DirectFET MD MOSFET Infineon DirectFET S3C MOSFET Infineon DirectFET MN MOSFET Infineon DirectFET MD MOSFET Infineon DirectFET SB MOSFET Infineon DirectFET ST MOSFET Infineon PLCC, 20 pins, dual row male, vertical entry Harwin LTek Connector, 3 pins, pitch 5mm, size 45x12.6mm^2, drill diamater 1.1mm, pad diameter 2.6mm, see http://www.mouser.com/ds/2/324/ItemDetail_1935161-922578.pdf, script-generated using https://github.com/pointhi/kicad-footprint-generator/scripts/TerminalBlock_RND THT terminal block RND 205-00022, 12 pins, pitch 5mm, size 65x9.8mm^2, drill diamater 1.1mm, pad diameter 2.6mm, see http://www.metz-connect.com/de/system/files/productfiles/Datenblatt_310671_RT019xxHDWC_OFF-023605N.pdf.
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