Labels Milestones
BackWuerth_HCI-1050, 10.2mmx10.2mm Inductor, Wuerth Elektronik, Wuerth_HCI-1040, 10.2mmx10.2mm Inductor, Wuerth Elektronik, Wuerth_MAPI-4020, 4.0mmx4.0mm Inductor, Taiyo Yuden, NR series, Taiyo-Yuden_NR-20xx, 2.0mmx2.0mm inductor taiyo-yuden md smd Inductor, Taiyo Yuden, MD series, Taiyo-Yuden_MD-5050, 5.0mmx5.0mm Inductor, Taiyo Yuden, NR series, Taiyo-Yuden_NR-30xx, 3.0mmx3.0mm Inductor, Wuerth Elektronik, Wuerth_HCI-1030, 10.6mmx10.6mm inductor Wuerth hci smd Inductor, Sagami, h=6.0mm, http://www.sagami-elec.co.jp/file/CER1242B-CER1257B-CER1277B.pdf Inductor, Sagami, h=8.0mm, http://www.sagami-elec.co.jp/file/CER1242B-CER1257B-CER1277B.pdf Sagami power inductor, CWR1242C, H=6.0mm (http://www.sagami-elec.co.jp/file/16Car_SMDCwr.pdf Sagami power inductor, 10.0x9.0x4.0mm, https://www.tme.eu/Document/bda580f72a60a2225c2f6576c2740ae1/dlg-0504.pdf Ferrocore DLG-0504 unshielded SMD power package (https://www.microsemi.com/packaging-information/partpackage/details?pid=5339, https://www.onsemi.com/pub/Collateral/457-04.PDF QFN, diode, 3.3x3.3x1mm (https://www.wolfspeed.com/media/downloads/846/C3D1P7060Q.pdf Diode, Universal, SMA (DO-214AC) Handsoldering Diode, Universal, MELF, RM10, Handsoldering, SMD, Thruhole, Diode Universal SMB(DO-214AA) SMC (DO-214AB) Handsoldering Diode SMB (DO-214AA) Handsoldering Diode SMA (DO-214AC) SMB (DO-214AA) Handsoldering Diode SMB (DO-214AA) Handsoldering Diode SMB (DO-214AA) Handsoldering Diode SMB (DO-214AA) Modified (http://www.littelfuse.com/~/media/electronics/datasheets/sidactors/littelfuse_sidactor_battrax_positive_negative_modified_do_214_datasheet.pdf.pdf Diode, Universal, SMB(DO-214AA) or SMC (DO-214AB), RM10, Handsoldering, SMD, Thruhole Diode SMC (DO-214AB) Handsoldering Diode SMA (DO-214AC) SMB (DO-214AA) Modified (http://www.littelfuse.com/~/media/electronics/datasheets/sidactors/littelfuse_sidactor_battrax_positive_negative_modified_do_214_datasheet.pdf.pdf Diode, Universal, SMA (DO-214AC) SMB (DO-214AA) Modified (http://www.littelfuse.com/~/media/electronics/datasheets/sidactors/littelfuse_sidactor_battrax_positive_negative_modified_do_214_datasheet.pdf.pdf Diode, Universal, SMC (DO-214AB), RM10, Handsoldering, SMD, Thruhole Diode Universal SMB(DO-214AA) SMC (DO-214AB) RM10 Handsoldering SMD Thruhole Diode, MicroMELF, Hand Soldering, http://www.vishay.com/docs/85597/bzm55.pdf Diode, MicroMELF, Reflow Soldering, http://www.vishay.com/docs/85597/bzm55.pdf Diode, MicroMELF, Hand Soldering, NF-Transformer ETAL P2781 SMD NF-Transformer, ETAL, P3191, SMD, Handsoldering, NF-Transformer ETAL P3188 SMD NF-Transformer, ETAL, P3188, SMD, Handsoldering, NF-Reansformer ETAL P3000 SMD Handsoldering For H1100NL, H1101NL, H1102NL, H1121NL, H1183NL, H1199NL, HX1188NL, HX1198NL and H1302NL. Https://productfinder.pulseeng.com/doc_type/WEB301/doc_num/H1102NL/doc_part/H1102NL.pdf H1100NL H1101NL H1102NL H1121NL H1183NL H1199NL HX1188NL HX1198NL H1302N Power Transformer, horizontal core with bobbin, 14 pin, 2.49 mm pitch, ultra thin SMD package; 3 leads; body: 4.3x6.1x0.43mm, https://www.vishay.com/docs/95570/to-277asmpc.pdf 3-pin TSOT23 package, http://cds.linear.com/docs/en/packaging/SOT_8_05-08-1637.pdf Texas Instrument DRT-3 1x0.8mm Pitch 0.7mm Texas Instruments, DSBGA, 1.5195x1.5195x0.600mm, 8 ball 3x3 area grid, NSMD, YZP0005 pad definition, 1.468x0.705mm, 8 Ball, 2x4 Layout, 0.4mm Pitch, https://www.st.com/resource/en/datasheet/stm32g051f8.pdf#page=102 ST WLCSP-25, ST die ID 450, 4.96x4.64mm, 156 Ball, 13x12 Layout, 0.35mm Pitch, https://www.ti.com/lit/ml/mxbg383/mxbg383.pdf, https://www.ti.com/lit/ds/symlink/tps62800.pdf Texas Instruments, DSBGA, area grid, YZF, YZF0016, 2.39x2.39mm, 16 Ball, 4x4 Layout, 0.5mm Pitch, https://www.st.com/resource/en/datasheet/stulpi01a.pdf TFBGA-64, 8x8 raster, 3.623x3.651mm package, pitch 0.4mm; see section 7.6 of http://www.st.com/resource/en/datasheet/DM00257211.pdf WLCSP-49, 7x7 raster, 3.029x3.029mm package, pitch 0.8mm; see section 6.8 of http://www.st.com/resource/en/datasheet/stm32f746zg.pdf WLCSP-144, 12x12 raster, 7x7mm package, pitch 0.8mm; see section 7.6 of http://www.st.com/resource/en/datasheet/stm32f207vg.pdf VFBGA-49, 7x7, 5x5mm package, pitch 0.5mm; see section 7.3 of http://www.st.com/resource/en/datasheet/stm32l011k3.pdf WLCSP-36, 6x6 raster, 2.605x2.703mm package, pitch 0.35mm; see section 7.6 of http://www.st.com/resource/en/datasheet/stm32f446ze.pdf UFBGA-169, 13x13 raster, 7x7mm package, pitch 0.4mm; see section 7.6 of http://www.st.com/resource/en/datasheet/stm32l151cc.pdf WLCSP-64, 8x8 raster, 4.539x4.911mm package, pitch 0.5mm; see section 7.8 of http://www.st.com/resource/en/datasheet/DM00387108.pdf Texas Instruments, DSBGA, area grid, YZR pad definition Appendix A BGA 1156 1 RF1157 RF1158 Virtex-7 BGA, 44x44 grid, 45x45mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=289.
- -7.292086e-003 -7.119738e+000 2.496000e+001 vertex 5.649070e+000 4.246676e+000 1.747200e+001.
- Elektronik, Wuerth_MAPI-2506, 2.5mmx2.0mm Inductor, Wuerth.