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Body [HTSSOP], with thermal pad with vias HTSSOP, 20 Pin (http://ww1.microchip.com/downloads/en/DeviceDoc/20%20Lead%20VQFN%203x3x0_9mm_1_7EP%20U2B%20C04-21496a.pdf), generated with kicad-footprint-generator ipc_noLead_generator.py WDFN, 8 Pin (http://ww1.microchip.com/downloads/en/DeviceDoc/8L_DFN_2x3x0_9_MC_C04-123C.pdf), generated with kicad-footprint-generator Molex Nano-Fit Power Connectors, 42820-62XX, With thermal vias in pads, 6 Pins.

• 3.00952 6.59 facet normal -0.241721 -0.727323 0.642318.
• 3.504650e+000 -2.753122e+000 2.488700e+001 facet normal.
• 1.56356 6.0001 facet normal 0.587776.

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