Labels Milestones
BackAllegro Microsystems 24-Lead Plastic QFN (4mm x 3mm) (see Linear Technology 05081955_0_DHC18.pdf DHD Package; 16-Lead Plastic HTSSOP (4.4x5x1.2mm); Thermal pad; (http://www.ti.com/lit/ds/symlink/drv8833.pdf HTSSOP, 16 Pin package with pin 2.
- DDPAK TO-263 D2PAK-3 TO-263-3.
- 3.5mm horizontal headphones jack.
- Copy or copies of.
- Square 2.5mm side length.