Labels Milestones
BackStuff *.DS_Store # Emacs temps *~ \#* # LTSpice Simulations/*.log Simulations/*.raw Simulations/*.txt Copper Layer Stackup: T5 15.200mm 0.5984" (1 hole Total plated holes Total unplated holes count 16 Not plated through holes: unplated through holes: ============================================================= From a22bca6d29ddc0a54597dab4d11ad9ab7e48e3c6 Mon Sep 17 00:00:00 2001 Subject: [PATCH] PCB initial layout, no traces "min_copper_edge_clearance": 0.0, PCB initial layout, no traces "min_copper_edge_clearance": 0.0, PCB initial layout, no traces "copper_text_size_h": 1.5, "copper_text_size_v": 1.5, "copper_text_thickness": 0.3, PCB initial layout, no traces "solder_mask_clearance": 0.0, PCB initial layout, no traces "copper_text_size_h": 1.5, "copper_text_size_v": 1.5, "copper_text_thickness": 0.3, PCB initial layout, no traces "silk_text_size_h.
- Normal 9.039253e-001 3.253948e-003 4.276780e-001 facet.
- LEA top entry JST NV series.
- 0 ] ,, Knurl's Height.
- RND 205-00069 pitch 7.5mm.
- Model, without Ground Terminal, with.